5SGXEB9R1H43C2LN

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 38 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB9R1H43C2LN – Stratix® V GX FPGA, 840,000 logic elements, 600 I/Os

The 5SGXEB9R1H43C2LN is an Intel Stratix V GX field programmable gate array (FPGA) designed for high-density, programmable digital logic. It delivers a large logic capacity and substantial on-chip memory for complex algorithms, signal processing, and systems that require extensive I/O connectivity.

Built in a high-pin-count 1760-BBGA (FCBGA) package with surface-mount mounting, this commercial-grade device targets applications that need significant embedded logic, memory resources, and flexible I/O within a compact package footprint.

Key Features

  • Logic Capacity  840,000 logic elements providing substantial programmable fabric for complex custom logic and parallel processing.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic to minimize external memory requirements.
  • I/O Density  600 I/O pins to support wide parallel interfaces, multi-channel sensors, and dense peripheral connectivity.
  • Package & Mounting  1760-BBGA, FCBGA package (supplier package: 1760-HBGA, 45×45 mm) with surface-mount mounting for high-pin-count board designs.
  • Power Supply  Core supply voltage range of 0.820 V to 0.880 V, enabling design planning for low-voltage core power domains.
  • Operating Temperature  Commercial operating range 0 °C to 85 °C to match standard commercial electronics environments.
  • RoHS Compliant  Device is RoHS compliant, supporting regulatory material requirements for many commercial designs.

Typical Applications

  • High-density digital processing  Use the large logic element count and embedded RAM to implement complex state machines, datapath acceleration, and custom compute engines.
  • Signal processing and streaming  On-chip memory and abundant logic enable buffering and real-time processing for streaming data and DSP workloads.
  • Multi‑interface systems  High I/O count supports designs that require numerous parallel interfaces, multi-channel sensors, or board-level connectivity.
  • FPGA-based prototyping  A high-capacity Stratix V GX device suitable for prototyping system architectures that need significant programmable resources.

Unique Advantages

  • Large programmable fabric: 840,000 logic elements let you consolidate complex functions into a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory and shortens data paths for lower latency.
  • Extensive I/O: 600 I/Os provide flexibility for interfacing multiple peripherals, buses, and high-bandwidth channels without external multiplexing.
  • Compact, high-pin package: 1760-BBGA (45×45 mm) package delivers maximum connectivity in a compact footprint for dense PCB layouts.
  • Commercial temperature and RoHS compliance: Designed for commercial environments (0 °C to 85 °C) and compliant with RoHS material requirements for broader market acceptance.
  • Low-voltage core domain: 0.820–0.880 V supply specification helps with power budgeting and integration into modern multi-voltage systems.

Why Choose 5SGXEB9R1H43C2LN?

The 5SGXEB9R1H43C2LN provides a high-capacity Stratix V GX FPGA solution combining 840,000 logic elements, significant on-chip RAM, and 600 I/Os in a 1760-BBGA package. It is positioned for designers who require dense programmable logic, large embedded memory, and extensive interfacing in a surface-mount commercial-grade device.

This part is well suited for teams developing complex digital systems, signal processing pipelines, and multi-interface boards that benefit from consolidating functionality into a single FPGA. The device’s electrical and packaging characteristics support scalable designs and practical board-level integration while meeting commercial environmental and RoHS requirements.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for part number 5SGXEB9R1H43C2LN.

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