5SGXEB9R1H43C2N

The 5SGXEB9R1H43C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1760-BBGA (FCBGA) package. It provides high logic capacity, abundant embedded memory and a large I/O count for demanding commercial designs.

Targeted at designs that require substantial on-chip logic, memory and transceiver-capable family features, this commercial-grade device delivers an integration point for complex system-level implementations within the specified operating voltage and temperature ranges.

Key Features

• Logic Capacity — 840,000 logic elements (logic cells) to implement large-scale digital designs and complex state machines.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, packet processing and data-path storage directly in the FPGA fabric.
• I/O Count — 600 user I/O pins for extensive peripheral, board-level and interconnect requirements.
• Transceiver Family Capability — As a Stratix V GX device, the family-level documentation specifies GX transceiver speed grades (family datasheet shows GX channel options up to 14.1 Gbps); refer to device documentation for specific channel configuration options.
• Power and Core Supply — Core supply range documented at 870 mV to 930 mV to match required power rails for the FPGA core.
• Package and Mounting — 1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45 × 45 mm); surface-mount device for board-level assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for commercial-class applications.
• RoHS Compliant — Device meets RoHS environmental compliance requirements.

Typical Applications

• High-speed serial and transceiver-based systems — Use the Stratix V GX family transceiver capabilities for designs that require serial link interfaces and channel aggregation.
• Large-scale programmable logic — Implement complex control logic, packet processing, or compute offload functions using the 840,000 logic elements and substantial on-chip RAM.
• High I/O board designs — Integrate numerous peripherals, memory interfaces and board-level interconnects leveraging the 600 I/O pins.
• Commercial embedded systems — Deploy in temperature-controlled commercial environments where a 0 °C to 85 °C rating is appropriate.

Unique Advantages

• High logic density: 840k logic elements provide headroom for complex state machines, DSP pipelines and multi-function designs without external logic.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces external memory dependence and simplifies board-level memory architectures.
• Extensive I/O capability: 600 I/Os enable integration of multiple parallel interfaces, memory buses and system control lines on a single device.
• Family-level transceiver options: Stratix V GX family documentation documents high-speed transceiver grades that support a range of serial link speeds for flexible system design choices.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Robust package for board-level assembly: 1760-BBGA (45 × 45 mm supplier package) provides a high-pin-count surface-mount solution for compact, high-density PCBs.

Why Choose 5SGXEB9R1H43C2N?

The 5SGXEB9R1H43C2N combines very large logic capacity, significant embedded RAM and a high I/O count in a single commercial-grade Stratix® V GX FPGA package. It is suited to system designs that require integrated memory, dense logic implementation and the family-level option of high-speed transceivers.

For engineering teams building complex, board-level commercial products, this device offers a balance of integration and scalability with documentation and device-level characteristics provided in the Stratix V family datasheet.

Request a quote or submit a purchase inquiry to start the procurement process for the 5SGXEB9R1H43C2N.