5SGXEB6R3F43I4

The 5SGXEB6R3F43I4 is a Stratix V GX field‑programmable gate array (FPGA) device offering very high logic density and on‑chip RAM for complex digital designs. It provides 597,000 logic elements, approximately 53.2 Mbits of embedded memory, and up to 600 I/O pins in a 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package.

Built to the Stratix V GX family specification, the device targets applications that require high integration, large programmable fabric, and robust industrial temperature operation (–40 °C to 100 °C). The Stratix V family also includes high‑speed transceiver options across defined speed grades for demanding serial link requirements.

Key Features

• Core logic density — 597,000 logic elements to implement complex FPGA designs and large-scale custom logic functions.
• On‑chip memory — Approximately 53.2 Mbits of embedded RAM for buffering, dataflow, and local storage.
• I/O capacity — Up to 600 I/O pins to support high‑pin‑count interfacing and dense board-level connectivity.
• High‑speed transceiver capability (series) — Stratix V GX family transceivers are specified up to 14.1 Gbps for applicable speed grades, providing options for high‑bandwidth serial links (per series datasheet).
• Power and core supply — Core voltage supply specified in the range 0.820 V to 0.880 V to match Stratix V core power requirements.
• Industrial temperature range — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Package and mounting — 1760‑FCBGA package (42.5 × 42.5 mm) in a surface‑mount form factor for high I/O density on modern PCBs.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High‑performance networking — Large logic capacity and the Stratix V GX family transceiver options support packet processing, switch fabric, and line card designs requiring dense I/O and high bandwidth.
• Data center acceleration — Significant embedded memory and logic elements enable custom compute kernels, protocol offloads, and FPGA acceleration functions.
• Telecommunications — High I/O count and series transceiver capabilities suit fronthaul/backhaul interfaces, protocol bridging, and timing‑sensitive data streams.
• Test & measurement — Large programmable fabric and deterministic operation across an industrial temperature range support high‑channel, high‑throughput instrumentation designs.

Unique Advantages

• High logic density: 597,000 logic elements provide headroom for large designs and multi‑function integration on a single device.
• Substantial on‑chip memory: Approximately 53.2 Mbits of embedded RAM reduces external memory dependency and improves throughput for streaming and buffering tasks.
• Extensive I/O capability: 600 I/O pins enable dense board‑level interfacing and support complex system interconnects.
• Industrial operating range: –40 °C to 100 °C rating supports deployment in industrial environments with wide thermal variation.
• Compact, high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) delivers high I/O count in a space‑efficient surface‑mount form factor.
• Defined core voltage range: 0.820 V to 0.880 V core supply specification enables precise power budgeting for system design.

Why Choose 5SGXEB6R3F43I4?

The 5SGXEB6R3F43I4 combines a large programmable fabric, substantial embedded memory, and a high I/O count in a single industrial‑rated Stratix V GX device. It addresses designs that require both compute density and robust I/O connectivity while fitting a compact 1760‑FCBGA footprint.

This device is suitable for engineering teams building complex networking, acceleration, or instrumentation systems who need verifiable, series‑specified transceiver options, clearly defined power and thermal operating windows, and RoHS compliance backed by the Stratix V family documentation.

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