5SGXEB6R3F43I3L

The 5SGXEB6R3F43I3L is a Stratix V GX field programmable gate array (FPGA) from Intel delivered in a 1760-ball FCBGA package. It provides a high-density programmable fabric with a large on-chip memory footprint and a broad I/O count intended for industrial-grade applications.

Designed for integration into complex digital and mixed-signal systems, this device targets use cases that require extensive logic capacity, significant embedded memory, and robust I/O capability while operating from a low-voltage core rail.

Key Features

• Core Logic – Provides 597,000 logic elements and 225,400 logic cells for large-scale programmable logic implementations.
• Embedded Memory – Approximately 53.2 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support large buffering, DSP, and state-machine requirements.
• I/O Capacity – Up to 600 user I/O pins to enable high channel counts and extensive board-level connectivity.
• Package & Mounting – 1760-FCBGA package (42.5 × 42.5 mm) supplied in a surface-mount form factor for dense board integration; package case listed as 1760-BBGA, FCBGA.
• Power – Low-voltage core operation with a specified supply range of 820 mV to 880 mV for the core domain.
• Thermal & Environmental – Industrial-grade operating temperature range from −40 °C to 100 °C; RoHS compliant.
• Series-Level Documentation – Stratix V device datasheet provides electrical and switching characteristics, speed grades, and transceiver information relevant to the Stratix V GX family.

Typical Applications

• Communications Infrastructure – High logic density and large embedded memory make this FPGA suitable for packet processing, protocol engines, and complex bridging functions that require many I/O channels.
• High-Performance Digital Processing – Large array of logic elements and significant on-chip RAM enable implementation of DSP pipelines, accelerators, and custom compute engines.
• Industrial Systems – Industrial temperature rating and surface-mount FCBGA packaging support deployment in harsh environments for control, monitoring, and automation equipment.
• Prototyping and System Integration – High I/O count and dense logic resources facilitate system-level prototyping and integration of multi-function subsystems on a single device.

Unique Advantages

• High Logic and Memory Integration: Combines 597,000 logic elements with approximately 53.2 Mbits of embedded RAM to reduce external memory needs and consolidate complex designs on-chip.
• Extensive I/O Resources: Up to 600 I/O pins support broad connectivity options and simplify board-level routing for multi-channel applications.
• Low-Voltage Core: Core supply range of 820 mV–880 mV supports modern low-voltage power architectures and system power optimization.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to address a wide range of environmental conditions in industrial deployments.
• RoHS Compliant: Meets RoHS requirements for environmental and regulatory compatibility.
• Compact, High-Density Package: 1760-FCBGA (42.5 × 42.5 mm) delivers high pin-count and dense integration suitable for compact system designs.

Why Choose 5SGXEB6R3F43I3L?

The 5SGXEB6R3F43I3L positions itself for designs that demand high programmable logic capacity, significant embedded memory, and wide I/O breadth within an industrial temperature envelope. Its low-voltage core operation and FCBGA packaging enable compact, power-conscious system architectures while retaining the scalability needed for complex digital subsystems.

This device is well suited for engineering teams building communications infrastructure, compute accelerators, and industrial control systems who require on-chip density, reliable thermal performance, and a datasheet-backed set of electrical characteristics for system-level integration.

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