5SGXEB6R3F43C4G

The 5SGXEB6R3F43C4G is a Stratix V GX family FPGA in a 1760‑FBGA package designed for commercial applications that require very high logic capacity, large embedded memory, and extensive I/O. As a Stratix V GX device, it is part of the Stratix V series documented in the Stratix V device datasheet and targets demanding digital designs where dense logic integration and rich I/O are key.

With 597,000 logic elements and approximately 53.248 Mbits of on‑chip RAM, this device supports complex, high‑capacity designs while offering a 600‑pin I/O interface and surface‑mount FCBGA packaging for board‑level integration.

Key Features

• Core Logic  Approximately 597,000 logic elements to implement large, complex digital designs.
• Embedded Memory  Approximately 53.248 Mbits of on‑chip RAM for deep buffering, look‑up tables, and state storage.
• I/O Density  600 I/O pins to support wide parallel interfaces, multiple peripherals, and complex board routing.
• Package & Mounting  1760‑FBGA (1760‑FCBGA) surface‑mount package; supplier package dimension listed as 1760‑FCBGA (42.5 × 42.5 mm) for system mechanical planning.
• Power  Documented core supply range of 820 mV to 880 mV for core power planning and regulator selection.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant.
• Stratix V GX Series Capabilities (datasheet)  The Stratix V family datasheet documents GX transceiver speed grades; series examples include GX channel options such as 14.1 Gbps and 12.5 Gbps in defined speed grades.

Typical Applications

• High‑Performance Data Processing  Large logic capacity and abundant on‑chip RAM enable complex packet processing, protocol handling, and custom compute pipelines.
• Networking & Telecom  Large I/O count and Stratix V GX family transceiver capabilities (per datasheet) make this device suitable for board designs requiring extensive parallel and high‑speed interfaces.
• Prototyping & System Integration  High logic density and rich I/O simplify integration of multi‑module systems and accelerate hardware development cycles.

Unique Advantages

• High Logic Density:  597,000 logic elements enable consolidation of large functions onto a single device, reducing board complexity.
• Significant Embedded Memory:  Approximately 53.248 Mbits of on‑chip RAM supports buffering and on‑chip data structures without external memory in many use cases.
• Extensive I/O Connectivity:  600 I/Os accommodate broad peripheral sets and complex interfaces without multiplexing compromises.
• Board‑Level Packaging:  1760‑FBGA/FCBGA (42.5 × 42.5 mm) surface‑mount package supports high‑density PCB layouts and standard assembly processes.
• Defined Core Power Window:  Core supply range of 820 mV–880 mV enables precise power delivery design and regulator selection for stable operation.
• Commercial Temperature Support:  Rated for 0 °C to 85 °C operation for mainstream commercial deployments.

Why Choose 5SGXEB6R3F43C4G?

This Stratix V GX FPGA combines very high logic element capacity, substantial embedded memory, and a large I/O count in a single FCBGA package, making it a fit for commercial designs that demand consolidation of complex digital functions. Use this device when you need to implement extensive custom logic, on‑chip buffering, and broad peripheral connectivity within a surface‑mount board design.

Backed by the Stratix V family documentation and datasheet, the part provides a clear specification set for power, temperature, package, and series transceiver characteristics to support reliable system design and integration planning.

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