5SGXEB6R3F43C3N

The 5SGXEB6R3F43C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) device optimized for high-density logic and large on-chip memory requirements. As a member of the Stratix V GX family, it offers substantial logic capacity, abundant I/O, and a compact 1760‑FCBGA package for surface‑mount system integration.

This commercial‑grade device is targeted at designs that require extensive programmable logic, significant embedded RAM, and a high I/O count within a single FPGA package, while operating within a core supply window of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 597,000 logic elements suitable for large-scale, highly parallel designs.
• Embedded Memory  Approximately 53.248 Mbits of on‑chip RAM to support buffering, large datasets, and complex state machines.
• High I/O Count  600 available I/O pins to accommodate dense board-level interfacing and multi-channel connectivity.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV for integration with regulated power domains.
• Package & Mounting  1760‑BBGA (1760‑FCBGA, 42.5 × 42.5 mm) surface‑mount package for compact, high‑pin‑count PCB designs.
• Commercial Grade & Environmental  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant for standard commercial applications and regulatory alignment.

Typical Applications

• High‑density data processing  FPGA logic capacity and on‑chip RAM enable parallel processing, packet buffering, and custom datapath implementations.
• Telecommunications and networking  Large I/O and memory resources support multi‑channel interfacing and protocol handling in network equipment.
• Advanced embedded systems  Suitable for compute‑intensive embedded platforms that require programmable logic and substantial local memory.
• Prototyping and algorithm acceleration  High logic element count and RAM density facilitate hardware prototyping and acceleration of compute kernels.

Unique Advantages

• High logic density: Approximately 597k logic elements reduce the need for multi‑FPGA partitioning in complex designs.
• Substantial on‑chip memory: Approximately 53.248 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Extensive I/O capability: 600 I/O pins provide flexibility for multi‑lane interfaces, parallel sensor arrays, and board‑level expansion.
• Compact, manufacturable package: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package balances pin count and PCB footprint for production designs.
• Commercial readiness and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Tight core voltage specification: Defined 820 mV to 880 mV supply window aids power‑rail planning and regulator selection.

Why Choose 5SGXEB6R3F43C3N?

The 5SGXEB6R3F43C3N delivers a balanced combination of very high logic capacity, substantial embedded memory, and a large I/O complement in a single commercial‑grade Stratix V GX device. Its 1760‑FCBGA surface‑mount package and defined core voltage make it suitable for dense, production PCB layouts where on‑chip resources reduce external component count.

Choose this FPGA when your design requires significant programmable logic and embedded RAM with broad I/O capability—ideal for advanced embedded systems, communications equipment, and high‑density data processing applications that operate within commercial temperature limits.

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