5SGXEB6R3F43C2LN

The 5SGXEB6R3F43C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1760-BBGA FCBGA package. It delivers a high-density programmable fabric with 597,000 logic elements and approximately 53 Mbits of embedded RAM, making it suitable for designs that require significant on-chip logic and memory resources.

Designed for commercial applications, this surface-mount device includes up to 600 general-purpose I/O and operates with a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant and rated for operation from 0 °C to 85 °C.

Key Features

• Core Density  597,000 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive functions without relying on external memory.
• I/O Capacity  Up to 600 I/O pins to support dense connectivity and multiple peripheral interfaces.
• High-Speed Transceivers  Stratix V GX transceiver speed grades support multi‑Gbps channel rates (Stratix V device datasheet lists GX channel rates up to 14.1 Gbps for applicable speed grades).
• Power  Core supply range from 820 mV to 880 mV, enabling defined power-domain design and regulation strategies.
• Package & Mounting  1760-FCBGA package (42.5 × 42.5 mm) in a 1760-BBGA footprint, surface-mount for board-level integration.
• Operating Range  Commercial temperature grade rated for 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Bandwidth Networking  Use the large I/O count and multi‑Gbps transceivers to implement packet processing, switching, and line-card functions.
• Data Processing & Acceleration  Leverage the dense logic and approximately 53 Mbits of on‑chip RAM for compute‑intensive accelerators and custom ASIC replacement.
• Telecommunications Equipment  Deploy in systems that require high channel counts and flexible signal routing using the large programmable fabric and I/O.
• Test & Measurement  Implement complex digital signal capture, preprocessing, and protocol handling where high I/O density and embedded memory reduce external component count.

Unique Advantages

• Highly Integrated Logic and Memory: 597,000 logic elements combined with approximately 53 Mbits of embedded RAM reduce the need for external logic and memory, simplifying board designs.
• Extensive I/O: Up to 600 I/O pins enable dense interfacing to front‑end devices, sensors, and high‑speed links.
• Multi‑Gbps Transceiver Support: Stratix V GX transceiver speed grades provide the ability to implement high‑speed serial links as documented in the device series datasheet.
• Compact, Surface‑Mount Package: The 1760‑FCBGA (42.5 × 42.5 mm) package offers high pin density in a board‑mountable form factor.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C to match a wide range of commercial applications.
• Regulatory Compliance: RoHS compliant for environmentally conscious designs.

Why Choose 5SGXEB6R3F43C2LN?

The 5SGXEB6R3F43C2LN positions itself as a high-density, commercially rated Stratix V GX FPGA well suited for designs that require extensive logic resources, substantial on‑chip memory, and a large number of I/O. Its documented transceiver capabilities in the Stratix V GX family and the device’s dense package make it appropriate for high‑bandwidth and memory‑heavy applications.

For engineering teams building complex networking, data‑processing, or telecom systems, this device provides a balance of programmable capacity and integration that supports scalable designs backed by the Stratix V device documentation and manufacturer resources.

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