5SGXEB6R3F43C2L

The 5SGXEB6R3F43C2L is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1760‑FBGA surface‑mount package. It delivers very large logic and memory resources—597,000 logic elements and approximately 53 Mbits of embedded memory—along with up to 600 I/O pins for complex, high‑density designs.

This device is supplied as a commercial‑grade FPGA (0 °C to 85 °C) and is RoHS compliant. The Stratix V GX family documentation included with the device describes available transceiver speed grades and device electrical characteristics for system design reference.

Key Features

• Logic Capacity — 597,000 logic elements and 225,400 LABs reported for implementing large, multi‑function digital designs.
• Embedded Memory — Approximately 53 Mbits of on‑chip RAM to support high buffering and local data storage requirements.
• I/O Density — Up to 600 general‑purpose I/O pins to support wide external connectivity and high‑pin‑count interfaces.
• Package and Mounting — 1760‑FCBGA / 1760‑BBGA package options; supplier device package dimension: 1760‑FCBGA (42.5 × 42.5 mm); surface‑mount mounting type.
• Power — Supply range specified at 820 mV to 880 mV for device operation.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance — RoHS compliant for regulatory alignment in commercial products.

Typical Applications

• High‑density digital processing systems — For projects requiring hundreds of thousands of logic elements and substantial embedded RAM for complex algorithms and datapaths.
• High‑I/O systems — Designs that need a large number of external interfaces and parallel connectivity benefit from the device’s up to 600 I/Os.
• Compact board‑level FPGA implementations — Surface‑mount 1760‑FCBGA packaging (42.5 × 42.5 mm) supports compact, high‑pin‑count board designs.

Unique Advantages

• Significant logic and memory integration: 597,000 logic elements plus approximately 53 Mbits of embedded RAM reduce the need for external logic and memory components.
• High external connectivity: Up to 600 I/Os enable broad peripheral and interface support without complex multiplexing.
• Package options for dense designs: 1760‑FCBGA footprint and surface‑mount format provide a high‑pin‑count solution in a compact package footprint.
• Commercial temperature rating: The 0 °C to 85 °C operating range aligns with a wide set of commercial electronics applications.
• Regulatory readiness: RoHS compliance supports environmental and regulatory requirements for many commercial products.

Why Choose 5SGXEB6R3F43C2L?

The 5SGXEB6R3F43C2L targets designers who need very large logic capacity, substantial on‑chip memory, and a high I/O count in a commercial‑grade FPGA. Its combination of 597,000 logic elements, approximately 53 Mbits of embedded memory, and up to 600 I/Os makes it well suited for advanced digital processing and board‑level implementations where integration density and connectivity are primary concerns.

Engineers selecting this Stratix V GX device gain a predictable specification set for core voltage (820–880 mV), package footprint (1760‑FCBGA, 42.5 × 42.5 mm), and commercial temperature operation, enabling straightforward design tradeoffs and BOM planning for medium‑to‑high complexity commercial systems.

If you require pricing, availability, or a formal quote for 5SGXEB6R3F43C2L, submit a request for quote or contact sales to obtain current lead‑time and procurement information.