5SGXEB6R3F40I4G

The 5SGXEB6R3F40I4G is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1517‑FBGA (40×40) package. It provides a high logic capacity device architecture with a large on‑chip memory array and extensive I/O for complex digital designs.

Targeted at industrial applications, this device combines 597,000 logic elements and approximately 53.25 Mbits of embedded memory with 432 I/Os, a surface‑mount 1517‑FBGA package, and an industrial operating temperature range for robust deployment in demanding environments.

Key Features

• Logic Capacity — 597,000 logic elements to implement large digital designs and complex system logic.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for data buffering, FIFOs, and storage close to logic.
• High I/O Count — 432 dedicated I/O pins to support extensive external interfacing and board-level connectivity.
• Transceiver Family (Series) — As a Stratix V GX device, the family includes GX transceiver speed grades described in the device datasheet for high‑speed serial links.
• Power Supply Range — Core voltage supply specified from 820 mV to 880 mV to support the device’s operating requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• Package and Mounting — 1517‑FBGA (40×40) supplier device package with surface‑mount mounting type for compact board integration.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Large logic capacity and industrial temperature rating enable implementation of complex control, PLC, and automation functions.
• High‑Density Digital Processing — The combination of hundreds of thousands of logic elements and substantial embedded memory supports compute‑intensive signal processing and data aggregation tasks.
• System I/O Aggregation — 432 I/Os allow extensive peripheral interfacing, protocol bridging, and board‑level integration in multi‑interface systems.

Unique Advantages

• Significant Logic Resources: 597,000 logic elements enable integration of large-scale digital functions into a single device, reducing board complexity.
• Substantial On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM keeps data and buffers close to logic, reducing external memory needs and latency.
• Extensive I/O Capacity: 432 I/Os provide flexibility for dense connectivity and multiple parallel interfaces without external multiplexing.
• Industrial Rating: Specified operation from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
• Compact Surface‑Mount Package: 1517‑FBGA (40×40) packaging supports space‑constrained board designs while enabling high pin counts.
• Standards‑oriented Family Features: As part of the Stratix V GX family, the series offers transceiver speed grades and electrical characteristics documented in the device datasheet for system design planning.

Why Choose 5SGXEB6R3F40I4G?

The 5SGXEB6R3F40I4G balances very large logic capacity and embedded memory with a high I/O count in an industrially rated Stratix V GX FPGA. Its combination of resources and package density makes it appropriate for designs that require consolidation of complex digital functions and extensive external interfacing in industrial environments.

For teams building high‑density, robust systems, this device offers an option to reduce board‑level complexity and support long‑term deployment with specifications and device characteristics documented in the Stratix V device datasheet.

Request a quote or submit an inquiry to get pricing and availability for the 5SGXEB6R3F40I4G and to discuss how it can fit into your next design.