5SGXEB6R3F40I3N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 319 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level2A (4 Weeks)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB6R3F40I3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

The 5SGXEB6R3F40I3N is a Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-FBGA (40×40) surface-mount package and graded for industrial use. This device combines high logic capacity, substantial embedded memory, and a large number of I/O for demanding industrial and embedded applications that require flexible hardware programmability and robust operating conditions.

Designed for applications that require significant on-chip resources, the device delivers approximately 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 432 I/O, while supporting a core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 597,000 logic elements provide high-density programmable fabric for complex logic and custom hardware implementations.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, state machines, and data-processing pipelines without external memory.
  • I/O Capacity  432 I/O pins enable wide peripheral connectivity and flexible interface routing for multi-channel designs.
  • Package & Mounting  1517-FBGA (40×40) surface-mount package optimizes board-level density while supporting industrial assembly processes.
  • Voltage Supply  Core voltage range of 820 mV to 880 mV to match system power-rail design and power-management strategies.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet temperature demands of industrial and ruggedized environments.
  • Regulatory  RoHS compliant, reflecting lead-free manufacturing and environmental compliance.

Typical Applications

  • Industrial Automation  Use the FPGA’s high logic capacity and 432 I/O to implement custom control logic, deterministic I/O handling, and protocol bridging in factory and process automation equipment.
  • Embedded Processing & Acceleration  Leverage the large on-chip memory and dense logic fabric to implement hardware accelerators, packet processing, or data-path engines within embedded systems.
  • Communications & Networking  The combination of high logic resources and abundant I/O supports implementation of custom protocol handling, bridging, and interface adaptation in networking equipment.
  • Test & Measurement  Robust temperature rating and configurable I/O make this device suitable for instrumentation that requires flexible signal processing and reliable operation across environments.

Unique Advantages

  • High Logic Capacity: Approximately 597,000 logic elements enable complex designs and multi-function implementations on a single device, reducing board-level component count.
  • Significant On-Chip Memory: Approximately 53.25 Mbits of embedded RAM provide substantial local storage for buffering, lookup tables, and state retention without immediate reliance on external memory.
  • Extensive I/O: With 432 I/O pins, the device supports multi-channel interfaces and flexible routing for diverse peripheral and sensor connectivity.
  • Industrial-Grade Operation: Rated from −40 °C to 100 °C to support deployment in demanding environments where temperature resilience is required.
  • Compact, Surface-Mount FBGA Package: The 1517-FBGA (40×40) package delivers high pin count in a compact footprint for space-constrained designs.
  • Low-Voltage Core: Core supply range of 820 mV to 880 mV enables integration with modern low-voltage power architectures.
  • RoHS Compliant: Meets environmental compliance requirements for lead-free assemblies.

Why Choose 5SGXEB6R3F40I3N?

The 5SGXEB6R3F40I3N balances high-density programmable logic, substantial embedded memory, and a large I/O count in an industrial-grade package, making it well suited for complex embedded and control applications. Its operating temperature range and RoHS compliance support deployment in industrial environments where reliability and regulatory compliance matter.

This device is a compelling choice for engineers and procurement teams building scalable, long-lived systems that require significant on-chip resources, flexible I/O, and a compact BGA footprint. Its combination of logic capacity, memory, and rugged operating range delivers design headroom for evolving system requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXEB6R3F40I3N Stratix® V GX FPGA and support your next high-capacity, industrial FPGA design.

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