5SGXEB6R3F40I3LG

The 5SGXEB6R3F40I3LG is an Intel Stratix® V GX field-programmable gate array supplied in a 1517-FBGA (40×40) package. This industrial-grade FPGA integrates high logic density, substantial embedded memory, and abundant I/O in a surface-mount BGA package for demanding embedded and system-level designs.

With approximately 597,000 logic elements, around 53.25 Mbits of on-chip RAM, and 432 I/Os, the device is suited to applications that require high integration, significant on-chip storage, and extensive I/O connectivity. Series-level documentation for Stratix V GX devices also describes multi-gigabit transceiver speed grades used across the family.

Key Features

• Core & Logic density  Approximately 597,000 logic elements enable complex digital designs and high-functional integration on a single device.
• Embedded memory  Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and large on-chip data structures.
• I/O capacity  432 user I/Os provide broad connectivity for peripherals, parallel buses, and external interfaces.
• Transceiver capability (series-level)  Stratix V GX series documentation specifies multiple transceiver speed grades (up to 14.1 Gbps in the series), enabling high-speed serial links where supported by the device family.
• Power  Voltage supply range specified at 0.820–0.880 V for core operation to support targeted power domains and system-level power planning.
• Package & mounting  1517-FBGA (40×40) supplier device package with surface-mount mounting type for compact board-level implementation.
• Industrial operating range  Rated for −40 °C to 100 °C operation, suitable for industrial-temperature applications.
• Regulatory status  RoHS compliant.

Typical Applications

• High-density digital systems  Implement complex state machines, custom accelerators, and dense logic partitions using the device’s large logic element count.
• On-chip buffering and memory-centric designs  Use approximately 53.25 Mbits of embedded RAM for packet buffering, FIFOs, and large LUT-based structures without external memory.
• Multi-I/O interface hubs  Leverage 432 I/Os to aggregate sensors, buses, and peripheral interfaces on a single FPGA for system consolidation.
• High-speed serial connectivity (where supported)  Within the Stratix V GX family transceiver speed grades, support for multi-gigabit serial links enables high-throughput channel designs.

Unique Advantages

• High logic capacity: Enables consolidation of complex functions and reduces the need for multiple devices in dense designs.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces dependency on external memory components and simplifies board design.
• Extensive I/O count: 432 I/Os provide flexibility to connect numerous peripherals or wide parallel interfaces directly to the FPGA.
• Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployment in industrial environments.
• Compact BGA package: 1517-FBGA (40×40) surface-mount packaging balances high integration with board-space efficiency.
• RoHS compliance: Aligns with common regulatory and environmental requirements for electronic assemblies.

Why Choose 5SGXEB6R3F40I3LG?

The 5SGXEB6R3F40I3LG delivers a combination of high logic density, large on-chip RAM, and abundant I/O in an industrial-grade Stratix V GX FPGA footprint. It is well suited for engineers needing a single-chip solution for complex digital processing, large buffering needs, and extensive peripheral interfacing within a compact BGA package.

Choosing this Stratix V GX part provides scalability and design headroom for demanding embedded and system-level applications, while the industrial temperature rating and RoHS compliance support reliable deployment in regulated and harsh environments.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGXEB6R3F40I3LG. Technical datasheet details are available for review to support integration and design planning.