5SGXEB6R3F40C4G

The 5SGXEB6R3F40C4G is a Stratix V GX field-programmable gate array (FPGA) from Intel, offered in a 1517-FBGA (40x40) surface-mount package. It provides a high-capacity programmable fabric combined with extensive I/O and embedded memory for demanding logic and I/O timing applications.

Designed for commercial-temperature operation, this device targets high-density programmable logic and high-speed I/O use cases where on-chip memory, a large population of logic elements, and documented electrical and switching characteristics are required.

Key Features

• Core density  Approximately 597,000 logic elements to implement large, complex designs.
• Embedded memory  Approximately 53.2 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O  432 general-purpose I/O pins to support wide parallel interfaces and multiple peripherals.
• Package & mounting  1517-FBGA (40x40) package in a surface-mount form factor for board-level integration.
• Power supply  Core voltage supply range: 820 mV to 880 mV, enabling defined operating conditions for the device core.
• Operating range  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Programmable I/O timing  Datasheet documents I/O timing features, including programmable I/O element (IOE) delay and programmable output buffer delay for fine-grained timing control.
• Transceiver-capable series  Stratix V GX devices are described in the series datasheet with transceiver speed grade options and switching characteristic information.
• Compliance  RoHS-compliant.

Typical Applications

• High-speed communications  Leverage the Stratix V GX family’s transceiver-capable architecture and documented switching characteristics for designs requiring robust I/O timing and high-speed links.
• Network and data processing  High logic density and substantial on-chip memory make the device suitable for packet processing, bridging, and protocol handling tasks.
• Advanced signal processing  Large logic capacity and embedded RAM enable implementation of complex signal processing pipelines and on-chip buffering.

Unique Advantages

• High integration density: Approximately 597,000 logic elements reduce the need for multiple devices in complex designs.
• Significant on-chip memory: Approximately 53.2 Mbits of embedded RAM supports large buffers, lookup tables, and local storage without external memory.
• Extensive I/O count: 432 I/O pins allow broad connectivity for parallel interfaces and multiple peripherals.
• Documented I/O timing controls: Programmable IOE delay and output buffer delay options documented in the Stratix V device datasheet help with timing closure and signal integrity.
• Compact board footprint: 1517-FBGA (40x40) package in a surface-mount form factor supports dense board designs.
• Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial deployments.

Why Choose 5SGXEB6R3F40C4G?

The 5SGXEB6R3F40C4G delivers a combination of high logic capacity, substantial embedded memory, and abundant I/O in a compact FBGA package, making it well suited for commercial applications that require dense programmable logic and careful I/O timing. Its documented electrical and switching characteristics in the Stratix V device datasheet support design verification and system-level integration.

Backed by Intel’s Stratix V device documentation, this FPGA is positioned for designers who need scalable logic density, on-chip RAM for buffering and processing, and a high I/O count in a surface-mount footprint.

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