5SGXEB6R3F40C4

The 5SGXEB6R3F40C4 is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offering high-density programmable logic and substantial embedded memory in a 1517-FBGA (40×40) package. It targets designs that require large logic capacity, significant on-chip RAM, and a high I/O count within a commercial temperature grade.

Key hardware parameters include 597,000 logic elements, approximately 53.248 Mbits of embedded memory, 432 I/Os, surface-mount 1517-FBGA packaging, and a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant and rated for commercial operation from 0 °C to 85 °C.

Key Features

• Core Logic Capacity 597,000 logic elements provide a large fabric for complex custom logic, state machines, and parallel processing implementations.
• Embedded Memory Approximately 53.248 Mbits of on-chip RAM to support data buffering, lookup tables, and on-chip storage for algorithm acceleration.
• High I/O Count 432 general-purpose I/Os to support wide parallel interfaces, multiple external peripherals, and dense board-level connectivity.
• Package & Mounting 1517-FBGA (40×40) surface-mount package for high-density board integration and reliable soldered interconnect.
• Power and Core Voltage Core supply voltage range from 820 mV to 880 mV, enabling defined core operating conditions for power planning and thermal design.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for standard commercial embedded and industrial-adjacent applications.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• High-density digital processing — Leverage 597,000 logic elements and large embedded RAM for complex logic synthesis, DSP pipelines, and custom datapaths.
• Wide-parallel interfaces — Use 432 I/Os to implement wide bus interfaces, multi‑lane connections, and dense peripheral integration.
• On-chip buffering and storage — Approximately 53.248 Mbits of RAM supports deep buffering, FIFO structures, and on-chip data staging for low-latency processing.

Unique Advantages

• Large programmable fabric: 597,000 logic elements enable implementation of sizable custom logic and parallel architectures without immediate need for partitioning across multiple devices.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM reduces external memory dependency for many designs, simplifying BOM and board layout.
• High I/O density: 432 I/Os provide flexibility to connect numerous peripherals, sensors, or wide data buses directly to the FPGA.
• Compact FBGA package: 1517-FBGA (40×40) balances high-pin count with a compact board footprint for space-constrained designs.
• Defined commercial operating range: 0 °C to 85 °C temperature rating and RoHS compliance support standard commercial deployments.
• Controlled core supply: 820 mV–880 mV core voltage range simplifies power-supply design and thermal modeling for the FPGA core.

Why Choose 5SGXEB6R3F40C4?

The 5SGXEB6R3F40C4 positions itself as a high-density member of the Stratix V GX family, delivering substantial logic and memory resources in a compact 1517-FBGA package. Its combination of 597,000 logic elements, approximately 53.248 Mbits of embedded RAM, and 432 I/Os makes it suitable for demanding designs that need on-chip capacity and extensive external connectivity within a commercial temperature range.

Designed for engineers and teams building complex, resource-intensive FPGA applications, this device offers a balance of integration, measurable electrical parameters (core voltage range 820–880 mV), and compliance attributes (RoHS) to support product development and production planning.

Request a quote or submit a pricing inquiry today to check availability, lead times, and volume pricing for part number 5SGXEB6R3F40C4.