5SGXEB6R3F40C3N

The 5SGXEB6R3F40C3N is a Stratix® V GX family FPGA from Intel, provided in a 1517-FBGA (40×40) surface-mount package. This commercial-grade device offers a high-density programmable fabric and abundant on-chip memory, making it suitable for complex digital designs that require large logic capacity and extensive I/O.

Designed for integration into production PCBs, the device combines a large logic element count, significant embedded RAM, and a wide I/O complement while operating at a core supply range of 820 mV to 880 mV under a commercial temperature range of 0 °C to 85 °C.

Key Features

• High-density core logic 597,000 logic elements provide substantial capacity for large-scale custom logic, compute pipelines, and complex state machines.
• Embedded memory Approximately 53.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
• Extensive I/O 432 I/O pins for broad interfacing options and multi-channel connectivity on a single device.
• Package and mounting 1517-FBGA (40×40) supplier device package with surface-mount mounting for reliable board-level integration.
• Power and supply Core voltage supply range of 820 mV to 880 mV to match system power domains and power delivery designs.
• Commercial temperature grade Rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS compliant Conforms to RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• High-density digital systems — Large logic capacity and embedded RAM enable complex custom accelerators, protocol engines, and data-path implementations.
• Network and communications modules — A 432-pin I/O complement supports multi-channel interface designs and board-level routing for communications equipment.
• Prototyping and OEM platforms — Commercial temperature rating and a compact 1517-FBGA surface-mount package simplify deployment in prototype and production boards.
• Compute and signal processing — Abundant logic and memory resources suit pipelined DSP functions and hardware-accelerated workloads.

Unique Advantages

• Substantial logic capacity: 597,000 logic elements reduce partitioning across multiple devices and simplify system architecture for large designs.
• Significant on-chip memory: Approximately 53.2 Mbits of embedded RAM cuts dependence on external memory for many buffering and storage needs.
• High I/O count: 432 I/O pins provide flexibility for multi-protocol connectivity and dense board-level interfacing.
• Compact, production-ready package: 1517-FBGA (40×40) surface-mount format eases integration into modern PCB assemblies.
• Commercial temperature and RoHS compliance: Clear operating range (0 °C to 85 °C) and environmental compliance streamline qualification for commercial products.
• Controlled core supply: Defined 820 mV–880 mV supply window aids predictable power design and system integration.

Why Choose 5SGXEB6R3F40C3N?

The 5SGXEB6R3F40C3N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA that balances large programmable logic, substantial embedded memory, and broad I/O in a production-friendly FBGA package. Its specification set supports complex, board-level implementations where consolidation of functionality into a single FPGA reduces BOM complexity and simplifies routing.

This device is well suited for development teams and OEMs targeting high-density digital designs, communications modules, and hardware-accelerated workloads that require on-chip RAM and extensive I/O while operating within a commercial temperature envelope. The combination of logic resources, memory capacity, and RoHS compliance provides a robust platform for scalable designs and long-term productization.

Request a quote or submit an inquiry to learn more about availability, pricing, and integration support for the 5SGXEB6R3F40C3N.