5SGXEB6R3F40I3G

The 5SGXEB6R3F40I3G is an Intel Stratix V GX Field Programmable Gate Array (FPGA) IC supplied in a 1517‑FBGA (40×40) package. This industrial‑grade device combines very high logic capacity with substantial on‑chip embedded memory and a large I/O count to support complex, high‑density programmable designs.

With 597,000 logic elements and approximately 53.25 Mbits of embedded memory, the device targets designs that require extensive programmable fabric, significant memory resources, and up to 432 I/O pins—while operating across a wide industrial temperature range and low core voltage window.

Key Features

• High Logic Capacity  Provides 597,000 logic elements to implement large, complex designs and multiple concurrent functions on a single FPGA.
• Substantial Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM for buffering, packet storage, and local data processing.
• Large I/O Count  432 I/Os to support high channel counts, wide parallel interfaces, and dense board-level connectivity.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C for reliable performance in industrial environments.
• Compact Surface-Mount Package  1517‑FBGA (40×40) surface‑mount package for high‑density system integration.
• Low Core Supply Range  Core voltage supply range of 820 mV to 880 mV to match system power‑management architectures.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Large logic density and wide temperature rating enable complex control algorithms, custom I/O handling, and real‑time processing in industrial systems.
• High‑Performance Signal Processing  Extensive logic resources and embedded RAM support multi‑channel DSP, filtering, and data aggregation tasks.
• Communications and Networking  High logic capacity and abundant I/O make the device suitable for protocol offload, packet processing, and interface bridging in communication equipment.

Unique Advantages

• Massive Programmable Fabric: 597,000 logic elements allow consolidation of multiple functions and IP blocks into a single device, reducing board-level component count.
• Large On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM minimizes external memory dependencies for buffering and state storage, simplifying system design.
• High I/O Density: 432 I/Os enable direct interfacing to many peripherals and parallel buses without heavy use of external multiplexers or expanders.
• Industrial Reliability: Specified -40 °C to 100 °C operation supports deployment in demanding industrial environments.
• Compact Integration: 1517‑FBGA (40×40) surface‑mount packaging facilitates high‑density board layouts while maintaining robust electrical performance.
• Power‑Managed Core Voltage: Narrow core supply range (0.82–0.88 V) aligns with modern power regulators used in high‑performance FPGA systems.

Why Choose 5SGXEB6R3F40I3G?

The 5SGXEB6R3F40I3G positions itself as a high‑capacity, industrial‑grade FPGA for applications that demand significant programmable logic, large embedded memory, and a generous I/O complement in a compact BGA package. Its combination of 597,000 logic elements, approximately 53.25 Mbits of on‑chip RAM, and 432 I/Os makes it well suited for consolidating complex system functions and reducing overall BOM complexity.

Designed for long‑lifecycle industrial deployments, the device offers a balanced mix of capacity, packaging, and operating‑condition specifications to support scalable designs backed by Intel’s Stratix V family documentation and device characteristics.

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