5SGXEB6R3F40I3LN

The 5SGXEB6R3F40I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517‑FBGA (40×40) package. It delivers high logic density and substantial on‑chip memory, making it suitable for complex, configurable digital designs in industrial environments.

This device provides up to 597,000 logic elements, approximately 53.2 Mbits of embedded memory, and 432 user I/O pins. It is designed for surface‑mount mounting and rated for industrial operating temperatures, supporting designs that require robust thermal and electrical operating margins.

Key Features

• High Logic Capacity  Provides 597,000 logic elements to implement large, complex designs and parallel processing architectures.
• Embedded Memory  Approximately 53.2 Mbits of total on‑chip RAM bits for buffering, FIFOs, and local data storage.
• Extensive I/O  432 I/O pins support dense external connectivity for high‑pin‑count systems and multi‑channel interfaces.
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Power and Core Supply  Core voltage supply range specified from 820 mV to 880 mV for the device core.
• Package and Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor to support compact board layouts and high I/O density.
• RoHS Compliant  Manufactured to comply with RoHS requirements.

Typical Applications

• High‑density digital systems  Implement complex logic fabrics and parallel algorithms using the device's large logic element count and embedded memory.
• I/O‑intensive interfaces  Systems requiring many external channels can leverage the 432 available I/O pins for sensors, control busses, or multiport connectivity.
• Industrial controls and equipment  Rated for −40 °C to 100 °C operation, the device is suited to industrial environments where temperature resilience is required.

Unique Advantages

• High integration density: 597,000 logic elements enable consolidation of large FPGA designs into a single device, reducing board complexity.
• Substantial on‑chip memory: Approximately 53.2 Mbits of RAM supports local buffering and reduces external memory dependency for many applications.
• Broad external connectivity: 432 I/O pins provide flexibility for signal routing and multiple peripheral interfaces without external multiplexing.
• Industrial operating range: Specified operation from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
• Compact BGA package: The 1517‑FBGA (40×40) package enables a dense PCB footprint while supporting high I/O counts and surface‑mount assembly.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for many procurement processes.

Why Choose 5SGXEB6R3F40I3LN?

The 5SGXEB6R3F40I3LN positions itself as a high‑capacity Stratix V GX FPGA option for designers who need large logic resources, extensive embedded memory, and significant I/O in a compact surface‑mount FBGA package. Its industrial temperature rating and defined core voltage range make it appropriate for demanding commercial and industrial applications.

For designs that require scalability, robust thermal tolerance, and a high level of on‑chip integration, this FPGA provides a strong combination of capacity and practical package features to reduce board count and simplify system architecture.

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