5SGXEB6R3F40I3L

The 5SGXEB6R3F40I3L is an Intel Stratix® V GX FPGA in a 1517‑FBGA (40×40) surface‑mount package. This industrial‑grade device provides high programmable logic capacity, a large embedded RAM resource, and a wide I/O count for designs that require substantial on‑chip resources.

Key device attributes include approximately 597,000 logic elements, approximately 53.25 Mbits of embedded memory, 432 user I/Os, an operating temperature range of −40 °C to 100 °C, and a core supply voltage range of 820 mV to 880 mV.

Key Features

• Core Logic  Approximately 597,000 logic elements to support large, complex programmable logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM, providing substantial storage for buffers, FIFOs, and working memory.
• I/O Capacity  432 user I/Os for extensive external interfacing and system integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact board integration.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in temperature‑demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density programmable logic designs  Use the device where extensive logic capacity and large embedded RAM are required to implement complex state machines, datapaths, or custom accelerators.
• I/O‑intensive systems  Leverage 432 user I/Os to connect multiple peripherals, buses, or daughtercards without external GPIO expanders.
• Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for control systems and factory automation equipment operating in wide temperature ranges.
• Compact board designs  1517‑FBGA (40×40) surface‑mount package supports space‑constrained PCBs while delivering high integration.

Unique Advantages

• High integration density: Approximately 597,000 logic elements and ~53.25 Mbits of embedded memory reduce the need for external logic and RAM, simplifying board design.
• Extensive external interfacing: 432 user I/Os enable broad connectivity options for complex systems and multi‑module designs.
• Industrial reliability: Rated for −40 °C to 100 °C operation to support deployment in temperature‑challenging environments.
• Compact, surface‑mount package: 1517‑FBGA (40×40) allows high integration density on compact boards while keeping the device in a standard SMT form factor.
• Clear electrical requirements: Documented core voltage range (820 mV–880 mV) simplifies power rail design and validation.

Why Choose 5SGXEB6R3F40I3L?

The 5SGXEB6R3F40I3L combines large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial‑rated Stratix V GX device. It is positioned for engineers and system designers who need on‑chip resources and rugged temperature performance while maintaining a compact board footprint.

Backed by the Stratix V device documentation family, this FPGA is suitable for designs that require scalability in logic and memory, clear electrical parameters for power design, and industrial temperature endurance for long‑term deployment.

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