5SGXEB6R3F40C4N

The 5SGXEB6R3F40C4N is a Stratix V GX Field Programmable Gate Array (FPGA) IC in a 1517‑FBGA (40×40) package designed for commercial applications. It provides a large programmable fabric with high I/O density and substantial on‑chip memory to support complex digital logic and system‑level integration.

Key attributes include approximately 597,000 logic elements, roughly 53.25 Mbits of embedded memory, 432 user I/O, and a low-voltage core supply range (820 mV to 880 mV), all in a surface‑mount FBGA package rated for 0 °C to 85 °C operation.

Key Features

• Programmable Logic Capacity Approximately 597,000 logic elements to implement large-scale custom logic and state machines.
• Embedded Memory Approximately 53.25 Mbits of on‑chip RAM for data buffering, FIFOs, and on‑device storage.
• I/O Density 432 user I/O pins to support wide parallel interfaces, multiple serial lanes, or mixed I/O requirements.
• Power and Core Supply Core voltage supply range: 820 mV to 880 mV, enabling optimized core power operation within the specified window.
• Package & Mounting 1517‑FBGA (40×40) package, surface‑mount assembly for high‑density board integration.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C (commercial grade) for standard environment deployments.
• Standards Compliance RoHS compliant for reduced hazardous substances in manufacturing and handling.

Typical Applications

• High‑throughput data processing Large logic capacity and substantial on‑chip RAM make this device suitable for compute‑intensive pipelines and FPGA‑based accelerators.
• Multi‑lane I/O systems High I/O count supports designs requiring numerous parallel interfaces or multiple external links.
• Prototyping and custom SoC integration Flexible programmable fabric and abundant resources enable system integration, glue logic, and proof‑of‑concept development for commercial products.

Unique Advantages

• High logical density: Approximately 597,000 logic elements provide the headroom needed to consolidate complex functions into a single device and reduce board-level BOM.
• Generous on‑chip memory: Around 53.25 Mbits of embedded RAM supports large buffers and local data storage to improve throughput and lower external memory dependence.
• Large I/O complement: 432 I/O pins enable dense connectivity to peripherals, sensors, or multi‑channel front ends without extensive external multiplexing.
• Compact, surface‑mount FBGA package: The 1517‑FBGA (40×40) form factor balances high pin count with a compact board footprint for space‑constrained designs.
• Commercial grade and RoHS compliant: Designed for standard commercial environments with environmental compliance for responsible manufacturing.

Why Choose 5SGXEB6R3F40C4N?

The 5SGXEB6R3F40C4N delivers a combination of high logic capacity, substantial embedded memory, and wide I/O capability in a compact FBGA package, making it well suited for demanding commercial designs that require on‑device compute and dense interfacing. Its low core voltage range and surface‑mount packaging support modern board designs that emphasize power efficiency and high integration.

This part is appropriate for teams building complex digital systems, multi‑channel interfaces, or FPGA‑based processing blocks where consolidating functionality into a single, verified device reduces system complexity and shortens development cycles.

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