5SGXEB6R3F43C2

The 5SGXEB6R3F43C2 is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, delivered in a 1760-ball FCBGA package. It provides a high-density programmable fabric with large on-chip memory and a substantial I/O complement for complex digital designs.

Documentation for the Stratix V family covers electrical and switching characteristics, transceiver specifications, and I/O timing, making this device suitable for designs that require integrated transceiver capabilities, extensive logic resources, and a high pin count in a surface-mount package.

Key Features

• High logic density — Approximately 597,000 logic elements to implement complex, parallel logic and custom datapaths.
• On-chip memory — Approximately 53.2 Mbits of embedded memory for buffering, packet storage, and algorithm working memory.
• Large I/O complement — 600 user I/O pins suitable for high-pin-count connectivity and multi-channel designs.
• Power and core voltage — Core supply range from 870 mV to 930 mV to match system power delivery designs.
• Package and mounting — 1760-FCBGA package (42.5 × 42.5 mm), surface-mount mounting for compact, high-density PCB layouts.
• Commercial grade — Rated for 0 °C to 85 °C operating temperature range for commercial applications.
• Standards and compliance — RoHS compliant.
• Family-level documentation — Stratix V device datasheet available covering electrical, switching, and transceiver characteristics for design validation.

Typical Applications

• Communications equipment — Use the device’s Stratix V GX family transceiver capabilities and large I/O count for protocol processing and multi-channel interfaces.
• Network and switch fabrics — High logic density and substantial embedded memory enable packet processing, buffering, and control-plane functions.
• Custom hardware acceleration — Implement compute- and data-intensive kernels using the large logic fabric and on-chip RAM.
• Prototyping and system integration — Surface-mount FCBGA package and extensive I/O support board-level evaluation and integration into complex systems.

Unique Advantages

• Highly programmable logic capacity: Approximately 597,000 logic elements provide the headroom needed for large, multi-module designs.
• Substantial on-chip RAM: Approximately 53.2 Mbits of embedded memory reduces dependence on external memory for many buffering and caching tasks.
• Extensive external connectivity: 600 I/O pins support dense peripheral and high-channel-count interfaces without additional switching logic.
• Compact high-pin package: 1760-FCBGA (42.5 × 42.5 mm) balances a high pin count with a manageable PCB footprint for advanced system designs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.
• Regulatory and manufacturing readiness: RoHS compliance simplifies adoption into standard product manufacturing flows.

Why Choose 5SGXEB6R3F43C2?

The 5SGXEB6R3F43C2 combines a high-density Stratix V GX programmable fabric with significant embedded memory and a 600-pin I/O complement in a 1760-FCBGA surface-mount package. Its commercial temperature grading and clear family-level documentation make it a practical choice for designers building complex digital systems that require integrated transceiver capabilities and large on-chip resources.

Engineers targeting communications equipment, network infrastructure, or custom acceleration platforms will find the device’s balance of logic, memory, and I/O suitable for scalable system designs while retaining a compact package footprint and RoHS compliance.

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