5SGXEB6R3F43C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,118 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB6R3F43C2G – Stratix® V GX FPGA, 597,000 Logic Elements, 600 I/Os
The 5SGXEB6R3F43C2G is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, offered in a 1760-FCBGA package. It delivers a large logic fabric, substantial on-chip embedded memory, and a high pin count suited for complex board-level designs.
Built for designers requiring dense logic integration and extensive I/O, this commercial-grade device combines 597,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 I/O pins to support high-capacity digital systems within a surface-mount 1760-FCBGA footprint.
Key Features
- Logic Capacity 597,000 logic elements for large-scale programmable logic and complex design implementation.
- Embedded Memory Approximately 53 Mbits of on-chip RAM to support large buffers, state machines, and intermediate data storage without external memory.
- I/O Density 600 I/O pins to provide extensive connectivity for high-pin-count interfaces and multi-channel systems.
- Package 1760-FCBGA (42.5 × 42.5 mm) surface-mount package suitable for compact, high-density board layouts; package case referenced as 1760-BBGA, FCBGA.
- Power Supply Core operating voltage range from 870 mV to 930 mV for the device core supply domain.
- Operating Temperature Commercial grade operating range of 0 °C to 85 °C, appropriate for commercial electronics applications.
- Standards & Compliance RoHS compliant for lead-free manufacturing and regulatory conformity.
- Family-Level Transceiver Capability Stratix V GX devices (family-level) are offered with transceiver speed grades referenced in the device datasheet for high-speed serial connectivity options.
Typical Applications
- High-density digital systems Used for designs that require extensive programmable logic and on-chip memory for complex control and processing tasks.
- High-pin-count interface aggregation Ideal where numerous parallel or multi-channel interfaces must be concentrated into a single FPGA with 600 I/Os.
- Board-level compute and protocol handling Suitable for implementing custom protocol logic, bridging, and offload functions that benefit from large logic and memory resources.
- High-speed serial integration (family-level) Applicable in designs leveraging Stratix V GX family transceiver options for high-speed serial links as described in the device datasheet.
Unique Advantages
- High logic density: With 597,000 logic elements, the device supports large, integrated designs without partitioning across multiple FPGAs.
- Substantial embedded memory: Approximately 53 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
- Extensive I/O connectivity: 600 I/Os enable consolidation of multiple interfaces and channels onto a single device, simplifying system routing and BOM.
- Compact, high-pin package: The 1760-FCBGA (42.5 × 42.5 mm) offers a high I/O count in a compact surface-mount footprint for dense PCB designs.
- Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronics deployments.
- RoHS compliant: Supports lead-free manufacturing and regulatory compliance requirements.
Why Choose 5SGXEB6R3F43C2G?
The 5SGXEB6R3F43C2G positions itself as a high-capacity, commercial-grade Stratix V GX FPGA option for designers who need dense logic resources, significant on-chip memory, and a large I/O footprint in a single surface-mount package. Its combination of 597,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 I/Os provides the integration necessary to reduce external components and simplify board-level architecture.
Backed by Intel’s Stratix V family documentation and available in a 1760-FCBGA package, this device is suited to development teams and procurement organizations building complex digital systems, high-pin-count interface modules, and solutions that leverage family-level high-speed transceiver capabilities. The commercial-grade temperature and RoHS compliance further support mainstream production and assembly requirements.
Request a quote or submit an inquiry today to discuss availability, pricing, and lead times for the 5SGXEB6R3F43C2G.

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