5SGXEB6R3F43C2G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 1,118 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB6R3F43C2G – Stratix® V GX FPGA, 597,000 Logic Elements, 600 I/Os

The 5SGXEB6R3F43C2G is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, offered in a 1760-FCBGA package. It delivers a large logic fabric, substantial on-chip embedded memory, and a high pin count suited for complex board-level designs.

Built for designers requiring dense logic integration and extensive I/O, this commercial-grade device combines 597,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 I/O pins to support high-capacity digital systems within a surface-mount 1760-FCBGA footprint.

Key Features

  • Logic Capacity  597,000 logic elements for large-scale programmable logic and complex design implementation.
  • Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffers, state machines, and intermediate data storage without external memory.
  • I/O Density  600 I/O pins to provide extensive connectivity for high-pin-count interfaces and multi-channel systems.
  • Package  1760-FCBGA (42.5 × 42.5 mm) surface-mount package suitable for compact, high-density board layouts; package case referenced as 1760-BBGA, FCBGA.
  • Power Supply  Core operating voltage range from 870 mV to 930 mV for the device core supply domain.
  • Operating Temperature  Commercial grade operating range of 0 °C to 85 °C, appropriate for commercial electronics applications.
  • Standards & Compliance  RoHS compliant for lead-free manufacturing and regulatory conformity.
  • Family-Level Transceiver Capability  Stratix V GX devices (family-level) are offered with transceiver speed grades referenced in the device datasheet for high-speed serial connectivity options.

Typical Applications

  • High-density digital systems  Used for designs that require extensive programmable logic and on-chip memory for complex control and processing tasks.
  • High-pin-count interface aggregation  Ideal where numerous parallel or multi-channel interfaces must be concentrated into a single FPGA with 600 I/Os.
  • Board-level compute and protocol handling  Suitable for implementing custom protocol logic, bridging, and offload functions that benefit from large logic and memory resources.
  • High-speed serial integration (family-level)  Applicable in designs leveraging Stratix V GX family transceiver options for high-speed serial links as described in the device datasheet.

Unique Advantages

  • High logic density: With 597,000 logic elements, the device supports large, integrated designs without partitioning across multiple FPGAs.
  • Substantial embedded memory: Approximately 53 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O connectivity: 600 I/Os enable consolidation of multiple interfaces and channels onto a single device, simplifying system routing and BOM.
  • Compact, high-pin package: The 1760-FCBGA (42.5 × 42.5 mm) offers a high I/O count in a compact surface-mount footprint for dense PCB designs.
  • Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronics deployments.
  • RoHS compliant: Supports lead-free manufacturing and regulatory compliance requirements.

Why Choose 5SGXEB6R3F43C2G?

The 5SGXEB6R3F43C2G positions itself as a high-capacity, commercial-grade Stratix V GX FPGA option for designers who need dense logic resources, significant on-chip memory, and a large I/O footprint in a single surface-mount package. Its combination of 597,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 I/Os provides the integration necessary to reduce external components and simplify board-level architecture.

Backed by Intel’s Stratix V family documentation and available in a 1760-FCBGA package, this device is suited to development teams and procurement organizations building complex digital systems, high-pin-count interface modules, and solutions that leverage family-level high-speed transceiver capabilities. The commercial-grade temperature and RoHS compliance further support mainstream production and assembly requirements.

Request a quote or submit an inquiry today to discuss availability, pricing, and lead times for the 5SGXEB6R3F43C2G.

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