5SGXEB6R3F43C2N

The 5SGXEB6R3F43C2N is a Stratix V GX field programmable gate array (FPGA) in a 1760-FCBGA package designed for high-density programmable logic applications. As a commercial-grade Stratix V GX device, it delivers a large logic fabric, substantial on-chip memory, and extensive I/O to support complex system designs.

This device is suitable for designs that require large amounts of programmable logic resources, abundant I/O, and integrated transceiver capability as described for the Stratix V GX family in the device datasheet.

Key Features

• High-density logic — 597,000 logic elements to implement complex digital functions and large-scale custom logic.
• Embedded memory — approximately 53 Mbits of on-chip RAM for buffering, packet storage, and on-chip data manipulation.
• Large I/O count — 600 I/O pins to simplify system integration and connect to wide parallel interfaces, multiple peripherals, or several high-speed links.
• Transceiver capability (Stratix V GX family) — Stratix V GX devices include high-speed transceiver support; the family supports GX channel rates up to 14.1 Gbps in applicable speed grades as documented in the device datasheet.
• Package and mounting — 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount format for compact board-level integration.
• Power — Core voltage supply operating range of 870 mV to 930 mV, enabling defined core power domains for system power planning.
• Commercial temperature grade — Rated for 0 °C to 85 °C ambient operation for commercial applications.
• Compliance — RoHS compliant.

Typical Applications

• High-speed serial communications — Use the Stratix V GX transceiver capabilities and abundant I/O to implement multi-gigabit links and protocol bridging.
• Packet processing and buffering — Large on-chip RAM (≈53 Mbits) supports packet buffering, FIFOs, and real-time data manipulation.
• Complex digital systems and prototyping — 597,000 logic elements accommodate large custom accelerators, protocol stacks, and hardware prototypes requiring dense programmable logic.
• I/O-rich system integration — 600 I/O pins simplify integration with wide data buses, multiple peripherals, or multi-channel interfaces.

Unique Advantages

• Highly integrated logic and memory: Combines hundreds of thousands of logic elements with approximately 53 Mbits of embedded RAM to reduce external memory requirements and simplify board design.
• Scalable high-speed connectivity: Stratix V GX family transceiver support enables multi-gigabit serial links suitable for demanding data-rate designs.
• Extensive I/O: 600 I/O pins minimize the need for external multiplexing and support richer system-level connectivity.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) provides a high-pin-count solution in a board-area-efficient package.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Defined core power window: Core supply range of 870 mV to 930 mV enables predictable power budgeting and thermal planning.

Why Choose 5SGXEB6R3F43C2N?

The 5SGXEB6R3F43C2N places a high-density Stratix V GX fabric, substantial embedded memory, and a large I/O count into a single 1760-FCBGA package. It is positioned for commercial designs that need significant programmable logic capacity, on-chip RAM for buffering and processing, and the family-level support for multi-gigabit transceivers.

Teams building complex digital systems, prototypes, or I/O-intensive solutions will find this device offers the integration and predictable electrical characteristics required for robust board-level designs while remaining within commercial temperature and power specifications.

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