5SGXEB6R3F43C3

The 5SGXEB6R3F43C3 is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1760-FCBGA package. It provides a high-density programmable fabric with substantial on-chip memory and broad I/O capability targeted for commercial temperature applications.

With 597,000 logic elements, approximately 53.25 Mbits of embedded RAM and 600 I/O pins, this device is suited to designs that require dense logic, significant on-chip storage, and extensive external connectivity while operating at a core supply in the 820 mV–880 mV range.

Key Features

• Logic Capacity  597,000 logic elements to implement large-scale, complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for large buffers, state storage, and memory-intensive logic without external memory dependency.
• I/O Resources  600 user I/O pins to support multiple parallel interfaces, board-level routing flexibility, and dense external connectivity.
• Power and Core Supply  Core voltage operating range of 820 mV to 880 mV to match targeted power-supply domains and design constraints.
• Package and Mounting  1760-FCBGA package (42.5 × 42.5 mm); surface-mount device suitable for compact board designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• Regulatory Compliance  RoHS compliant for environmental and manufacturability requirements.

Typical Applications

• High-density digital systems  Implement large-scale custom logic and state machines using the device’s 597,000 logic elements and substantial embedded RAM.
• I/O-intensive designs  Systems requiring many external interfaces and parallel buses can leverage the 600 available I/O pins for broad connectivity.
• On-chip buffering and memory-heavy logic  Applications that need sizable internal storage can use approximately 53.25 Mbits of embedded memory to reduce external memory requirements and simplify board-level BOM.

Unique Advantages

• Highly integrated logic and memory: The combination of 597,000 logic elements and ~53.25 Mbits embedded RAM lets designers consolidate functions on-chip, reducing system complexity.
• Extensive external connectivity: 600 I/O pins enable flexible interfacing to peripherals, sensors, and parallel data paths without extensive multiplexing.
• Commercial operating range: Rated 0 °C to 85 °C for deployments in standard commercial environments.
• Compact FCBGA packaging: The 1760-FCBGA (42.5 × 42.5 mm) delivers high gate density in a board-friendly surface-mount format.
• Standards-compliant manufacturing: Surface-mount package and RoHS compliance support modern assembly and environmental requirements.

Why Choose 5SGXEB6R3F43C3?

This Stratix V GX FPGA is positioned for commercial designs that require a blend of large programmable logic capacity, significant on-chip memory, and broad I/O availability. Its specification set—including 597,000 logic elements, approximately 53.25 Mbits of embedded RAM, 600 I/Os, and operation within a 0 °C–85 °C range—makes it appropriate for complex digital processing, intensive buffering, and multi-interface applications where integration and board-level consolidation are priorities.

As a member of the Stratix V family, the device is supported by Stratix V device documentation and delivers a platform-level option for customers scaling complex FPGA-based systems while maintaining predictable electrical and packaging specifications.

Request a quote or submit an inquiry to evaluate 5SGXEB6R3F43C3 for your next high-density FPGA design project.