5SGXEB6R3F43C3G

The 5SGXEB6R3F43C3G is a Stratix V GX field programmable gate array (FPGA) IC from Intel, designed to provide high logic capacity and on-chip memory in a package suitable for compact, high-density designs. As a member of the Stratix V GX family, the device addresses designs that require large programmable logic resources, significant embedded memory, and extensive I/O connectivity.

With a commercial operating temperature range and low core voltage operation, this device suits applications that require dense logic integration, substantial embedded RAM, and a high I/O count while maintaining compliance with RoHS requirements.

Key Features

• Core Logic — Approximately 597,000 logic elements to support complex, high-density designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for data buffering, lookup tables, and intermediate storage.
• I/O Capability — 600 user I/Os to interface with high-pin-count systems and multiple peripherals.
• Package — 1760-ball FCBGA (1760-FCBGA, 42.5 × 42.5 mm) high-density package for space-efficient board integration.
• Power — Core supply voltage range of 820 mV to 880 mV for low-voltage core operation.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
• Series Capabilities — As part of the Stratix V GX family, the series documentation describes commercial and industrial speed grades and high-speed transceiver options available in the family.
• Compliance — RoHS compliant.

Typical Applications

• High-density logic systems — Use the large pool of logic elements and embedded RAM for complex state machines, large-scale finite-state implementations, and tightly integrated custom logic.
• Networking and communications — Leverage the Stratix V GX family transceiver capabilities and abundant I/O count for data-path and protocol processing in communication equipment.
• Compute acceleration and DSP — Utilize the sizable on-chip RAM and logic resources for buffering and parallel data processing in acceleration and signal-processing tasks.
• System prototyping and integration — Large logic capacity and extensive I/O simplify consolidation of multiple functions into a single FPGA for rapid prototype and system-level integration.

Unique Advantages

• High logic density: Approximately 597,000 logic elements enable consolidation of complex functions and reduce the need for multiple devices.
• Substantial embedded memory: Around 53.25 Mbits of on-chip RAM supports deep buffers and local data storage, improving throughput and latency for data-intensive tasks.
• Extensive I/O support: 600 I/Os allow flexible interfacing with multi-channel systems, sensors, transceivers, and peripheral devices.
• Compact, robust package: 1760-FCBGA (42.5 × 42.5 mm) provides a high-pin-count solution in a compact footprint for space-constrained designs.
• Low-voltage core operation: 820 mV–880 mV supply range supports designs optimized for reduced core power consumption.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose 5SGXEB6R3F43C3G?

The 5SGXEB6R3F43C3G offers a combination of high logic capacity, significant embedded memory, and a large I/O count in a compact FCBGA package, making it a practical choice for designers targeting dense, integrated FPGA implementations. It is positioned for projects that require substantial on-chip resources and flexible I/O without moving to industrial temperature grades.

Backed by the Stratix V GX family documentation and Intel’s device support, this device is suitable for teams building complex communication, processing, or prototyping platforms that benefit from scalable logic, embedded RAM, and broad interfacing capability.

Request a quote or submit an inquiry to evaluate 5SGXEB6R3F43C3G for your next high-density FPGA design.