5SGXEB6R3F43C4N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,206 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB6R3F43C4N – Stratix® V GX FPGA, 1760-FCBGA
The 5SGXEB6R3F43C4N is a Stratix® V GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It provides a large array of programmable logic, substantial embedded RAM, and a high I/O count for complex digital designs.
Targeted at commercial-grade applications, this device combines 597,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 600 I/Os to support designs that require high logic capacity, extensive memory, and broad external interfacing while operating within a 0 °C to 85 °C temperature range.
Key Features
- Core Logic 597,000 logic elements provide a large programmable fabric for complex digital functions and custom processing pipelines.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM supports data buffering, LUT-based structures, and memory-intensive logic.
- High I/O Count 600 user I/Os enable extensive external connectivity for parallel interfaces, multiple peripherals, and board-level integration.
- Package and Mounting 1760-BBGA, FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) with surface-mount construction for compact, high-density PCB assemblies.
- Power and Core Voltage Core voltage supply range specified at 820 mV to 880 mV to match precise power delivery requirements for the device.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Custom FPGA-based systems Implement complex, application-specific logic where large logic capacity and on-chip RAM are required.
- High-density I/O control Use the 600 I/Os for multi-channel control, parallel interfaces, and extensive sensor or actuator grids.
- Memory-intensive processing Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet storage, or LUT-heavy implementations.
Unique Advantages
- Large programmable fabric: 597,000 logic elements enable integration of complex state machines, datapaths, and custom accelerators on a single device.
- Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependence on external memory for many designs, simplifying board-level BOM and routing.
- Extensive external connectivity: 600 I/Os provide flexibility for interfacing multiple peripherals, buses, and parallel data streams without additional glueless interfaces.
- Compact, assembly-ready package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density PCB layouts while preserving signal integrity at package exits.
- Commercial-grade operating range: Rated 0 °C to 85 °C to match typical commercial environmental requirements.
- RoHS compliance: Meets environmental and manufacturing material requirements for lead-free production.
Why Choose 5SGXEB6R3F43C4N?
The 5SGXEB6R3F43C4N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suitable for designs that demand a large logic count, significant embedded RAM, and broad I/O capability in a single package. Its 1760-FCBGA form factor and surface-mount mounting make it appropriate for compact, high-density assemblies.
Designers and procurement teams seeking a commercially rated FPGA with precise core voltage requirements (820 mV to 880 mV) and a wide complement of I/Os will find this device well suited to integrate substantial programmable logic and memory on board while maintaining RoHS compliance.
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