5SGXEB6R3F43I3LG

The 5SGXEB6R3F43I3LG is a Stratix® V GX FPGA in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package designed for industrial-grade applications. It combines high logic capacity, substantial on-chip memory, and high I/O density to support complex, high-performance programmable designs.

Key engineering attributes include approximately 597,000 logic elements, roughly 53.248 Mbits of embedded memory, a 600-pin I/O count, an industrial operating range of –40 °C to 100 °C, and a core voltage supply window of 820 mV to 880 mV.

Key Features

• Core Logic Capacity — Approximately 597,000 logic elements provide a large fabric for implementing complex custom logic, parallel processing, and hardware acceleration.
• LABs/CLBs — 225,400 LABs/CLBs available for organizing logic resources and hierarchical design partitioning.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support buffering, FIFO structures, and state storage without external memory dependency.
• I/O Density — 600 user I/O pins enable extensive external interfacing for multi-channel connectivity and high-pin-count boards.
• Power and Voltage — Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements and power-management strategies.
• Package and Mounting — 1760-FCBGA (42.5 × 42.5 mm) FCBGA package in a surface-mount form factor for high-density PCB integration.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Compliant with RoHS requirements for lead-free manufacturing and environmental considerations.

Typical Applications

• High-density processing — Use the ~597,000 logic elements to implement large custom datapaths, signal processing pipelines, and parallel accelerators.
• On-chip buffering and memory-intensive logic — Approximately 53.248 Mbits of embedded memory for deep buffering, packet processing, and state retention without external RAM.
• High-pin-count external interfaces — 600 I/O pins support multi-channel connectivity, dense sensor or peripheral arrays, and complex board-level routing.
• Industrial systems — Rated for –40 °C to 100 °C operation, suitable for industrial control and instrumentation applications requiring extended temperature range.

Unique Advantages

• Highly integrated logic fabric: Large logic element count allows consolidation of multiple functions into a single device, reducing system complexity.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependence on external memory and improves latency for buffering and state machines.
• Extensive I/O capacity: 600 I/O pins support dense external connectivity and flexible interfacing options.
• Industrial temperature rating: –40 °C to 100 °C operating range supports deployment in harsher environments where extended temperature performance is required.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5) surface-mount package enables high-pin-count integration in space-constrained board designs.
• Controlled core voltage range: 820 mV to 880 mV supply window supports predictable power budgeting and thermal planning.

Why Choose 5SGXEB6R3F43I3LG?

The 5SGXEB6R3F43I3LG positions itself as a high-capacity Stratix® V GX FPGA option for industrial designs that demand a combination of large logic resources, significant embedded memory, and broad I/O connectivity. Its industrial temperature rating and RoHS compliance make it suitable for long-life deployments where reliability and regulatory conformance matter.

Engineers targeting complex, high-density programmable systems will find this device appropriate for consolidating functions, minimizing external components, and scaling designs while retaining predictable power and thermal characteristics provided by the specified core voltage range and package format.

Request a quote or submit a pricing and availability inquiry to receive detailed lead-time and purchasing information for the 5SGXEB6R3F43I3LG Stratix® V GX FPGA.