5SGXEB6R3F40I4N

The 5SGXEB6R3F40I4N is an Intel Stratix® V GX field-programmable gate array (FPGA) IC offering high-density programmable logic and substantial on-chip memory. It provides 597,000 logic elements and approximately 53.25 Mbits of embedded memory, combined with 432 general-purpose I/O pins in a compact 1517‑FBGA (40×40) package.

Built and graded for industrial use, this surface‑mount FPGA supports a core voltage supply range of 0.820 V to 0.880 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that demand robust thermal performance and a high degree of integration.

Key Features

• Core Logic  597,000 logic elements provide substantial programmable capacity for complex digital designs and custom compute acceleration.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, state storage, and data-path implementations without relying solely on external memory.
• I/O Density  432 I/O pins enable broad interfacing options for multi‑lane data connections, control signals, and peripheral integration.
• Power Supply  Core voltage support from 0.820 V to 0.880 V to match low-voltage core rails used in modern FPGA designs.
• Packaging & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact, board‑level integration.
• Industrial Grade & Temperature Range  Rated grade: Industrial; operating temperature range −40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the FPGA’s high logic density and industrial temperature rating to implement custom motor control, PLC functions, and deterministic I/O processing.
• Communications and Network Processing  Large on-chip memory and abundant I/O enable protocol offload, packet buffering, and interface bridging for networking equipment.
• High‑Performance Embedded Systems  Implement custom accelerators, signal processing chains, or complex state machines where large programmable fabric and embedded RAM reduce external component count.
• Test, Measurement, and Instrumentation  Leverage dense logic and many I/Os for real‑time data capture, preprocessing, and flexible instrumentation control.

Unique Advantages

• High Logic Capacity: 597,000 logic elements provide headroom for complex FPGA designs without immediately requiring device partitioning.
• Significant On‑Chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependence on external memory and simplifies board layout.
• Broad I/O Count: 432 I/Os support multiple interfaces and parallel data paths, enabling flexible system-level integration.
• Industrial Reliability: Industrial-grade specification and −40 °C to 100 °C operating range support deployment in harsh or temperature-variable environments.
• Compact BGA Package: 1517‑FBGA (40×40) packaging delivers a dense solution footprint suitable for space-constrained PCBs.
• Low‑Voltage Core Support: Narrow core supply range (0.820 V–0.880 V) aligns with modern low-voltage FPGA core rails for consistent power management.

Why Choose 5SGXEB6R3F40I4N?

The 5SGXEB6R3F40I4N positions itself as a high-density, industrial‑grade FPGA for projects that require extensive programmable resources, significant embedded memory, and a high count of I/O signals in a compact surface‑mount package. Its specifications support complex logic implementations and board-level consolidation of functions that otherwise would require multiple components.

This Intel Stratix® V GX device is well suited for design teams building industrial control systems, advanced communications equipment, or high-performance embedded platforms where long-term robustness, logic capacity, and on-chip memory are essential design drivers.

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