5SGXEB6R3F40C3

The 5SGXEB6R3F40C3 is a Stratix V GX series Field Programmable Gate Array (FPGA) in a 1517‑FBGA (40×40) package, optimized for high-density digital integration. It combines large programmable logic capacity, extensive on‑chip memory, and a high pin count to support complex system designs.

Targeted at commercial-grade applications, this device is suited for designs that require substantial logic resources and broad I/O connectivity while operating within a commercial temperature range.

Key Features

• High Logic Capacity  Approximately 597,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• Large I/O Count  432 device I/Os to support wide parallel interfaces, multi-channel sensor/data paths, and board-level connectivity.
• Power Supply Range  Core supply specified between 820 mV and 880 mV for the device core power domain.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial environments.
• Package & Mounting  1517‑FBGA (40×40) surface-mount package for high-pin-count, space-efficient board implementations.
• Standards & Compliance  RoHS-compliant device, meeting lead‑free environmental requirements.

Typical Applications

• High‑density digital systems: Use the large logic capacity and embedded memory to consolidate complex logic functions and data paths on a single device.
• Multi‑channel I/O platforms: 432 I/Os enable board-level designs requiring extensive parallel interfaces or multiport connectivity.
• Signal processing and instrumentation: Large on‑chip RAM and abundant logic elements support buffering, streaming data manipulation, and algorithm implementation.
• System prototyping and integration: The combination of logic resources and high I/O count supports rapid prototyping and integration of subsystem functions.

Unique Advantages

• Substantial on‑device logic resource: Approximately 597,000 logic elements allow consolidation of multiple functions without immediate partitioning across devices.
• Significant embedded memory: Approximately 53 Mbits of RAM provides local storage for high-throughput data handling and pipeline staging.
• High I/O density: 432 I/Os enable flexible interfacing with peripherals, sensors, and high‑channel systems on a single FPGA.
• Commercial-grade operation: Specified 0 °C to 85 °C operating range for designs targeting commercial environments.
• Industry-standard BGA packaging: 1517‑FBGA (40×40) surface-mount package supports compact, high-pin-count board layouts.
• RoHS compliant: Meets common environmental requirements for lead‑free assembly.

Why Choose 5SGXEB6R3F40C3?

The 5SGXEB6R3F40C3 delivers a balanced combination of high logic density, substantial on‑chip memory, and wide I/O capability in a compact FBGA package, making it well suited for commercial designs that demand large-scale programmable logic and extensive connectivity. Its specified core voltage range and commercial temperature rating provide clear implementation parameters for system power and thermal planning.

Engineers and procurement teams looking to implement complex digital functions, multi‑channel interfaces, or prototype consolidated system logic will find this Stratix V GX device a capable option that aligns with established device-level specifications and compliance expectations.

Request a quote or submit an inquiry to purchase the 5SGXEB6R3F40C3 and include your quantity and delivery requirements for a prompt response.