5SGXEB6R3F40C2LG

The 5SGXEB6R3F40C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable fabric with 597,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 432 I/Os in a compact 1517‑FBGA (40×40) package.

Designed for commercial applications, this surface‑mount FPGA combines large on‑chip memory, extensive I/O, and a low-voltage core supply to address demanding digital logic, signal processing, and system integration tasks while meeting RoHS requirements.

Key Features

• Core Capacity 597,000 logic elements to implement large, complex digital designs and algorithms.
• Embedded Memory Approximately 53.25 Mbits of on‑chip RAM for buffering, FIFOs, and data‑intensive processing.
• I/O Density 432 I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Power Supply Core voltage supply range of 820 mV to 880 mV to match low‑voltage system architectures.
• Package & Mounting 1517‑FBGA (40×40) package, surface‑mount for compact board layouts and high‑density assembly.
• Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for lead‑free assembly and environmental regulatory alignment.

Typical Applications

• Networking & Communications High logic capacity and abundant I/O make the device suitable for complex packet processing, protocol handling, and custom interface bridging.
• Compute Acceleration Large programmable fabric and embedded RAM support offload and hardware acceleration for parallel workloads and algorithmic pipelines.
• Video and Signal Processing Substantial on‑chip memory and logic enable real‑time filtering, encoding/decoding, and multi‑channel processing tasks.
• System Integration & Prototyping Dense resources and many I/Os are useful for integrating multiple functions on a single device during prototyping and product development.

Unique Advantages

• High-density programmable fabric: 597,000 logic elements provide the headroom for complex state machines, DSP pipelines, and custom accelerators.
• Large embedded memory: Approximately 53.25 Mbits of RAM reduces external memory dependence and improves deterministic data handling.
• Extensive I/O count: 432 I/Os simplify board-level interfacing and allow parallel connections to multiple subsystems without external expanders.
• Low-voltage core operation: 820–880 mV core supply supports power-optimized system designs.
• Compact FBGA package: 1517‑FBGA (40×40) supports high-density PCB integration while maintaining robust assembly compatibility.
• RoHS compliant: Meets lead‑free manufacturing and environmental requirements for commercial products.

Why Choose 5SGXEB6R3F40C2LG?

The 5SGXEB6R3F40C2LG positions itself as a capacious, commercially graded Stratix V GX FPGA for engineering teams that need abundant logic, significant embedded memory, and a high I/O count in a compact package. Its low-voltage core and RoHS compliance make it suitable for modern, energy‑aware commercial systems.

Designed and documented within the Intel Stratix V family, the device is appropriate for developers focused on scalable FPGA implementations where on‑chip memory and I/O density directly impact system integration and BOM reduction.

Request a quote or submit an RFQ for part number 5SGXEB6R3F40C2LG to begin procurement or to obtain pricing and availability information.