5SGXEB6R2F43I3N

The 5SGXEB6R2F43I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides high on-chip logic density, a large embedded RAM capacity, and a high pin count I/O topology in a 1760‑FBGA package, suitable for designs that require substantial programmable logic and connectivity.

As a Stratix V GX device, this part is part of the Stratix V family that is available in industrial temperature grades and transceiver speed grades (as described in the device datasheet). The device’s combination of logic elements, embedded memory, and 600 I/Os supports complex, high-density FPGA implementations.

Key Features

• Logic Capacity  Approximately 597,000 logic elements (cells) to implement large-scale programmable logic and complex designs.
• Embedded Memory  Approximately 53.248 Mbits of embedded RAM for on-chip buffering, state storage, and intermediate data processing.
• High I/O Count  600 I/O pins to support wide parallel interfaces and multiple high-density peripheral connections.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
• Low-Voltage Core Supply  Core voltage supply range of 820 mV to 880 mV to meet device operating requirements.
• Package & Mounting  1760‑FBGA (1760‑FCBGA, 42.5 × 42.5 mm) surface‑mount package for compact, high‑pin‑count board designs.
• Standards Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Use the industrial temperature rating (–40 °C to 100 °C) and large logic capacity for control systems and automation platforms requiring robust operation across wide temperature ranges.
• High‑Density Signal Processing  Leverage nearly 597,000 logic elements and approximately 53.248 Mbits of embedded RAM for DSP pipelines, data aggregation, and protocol processing.
• High‑Pin‑Count Interface & Bridging  With 600 I/Os, implement wide parallel buses, multi‑lane interfaces, and protocol bridging between multiple subsystems.

Unique Advantages

• Substantial On‑Chip Logic:  A large pool of logic elements enables integration of complex state machines, custom accelerators, and extensive glue logic within a single device.
• Significant Embedded Memory:  Approximately 53.248 Mbits of RAM reduces external memory dependencies and supports on‑chip buffering and real‑time data handling.
• High Connectivity:  600 I/Os provide flexibility to connect multiple peripherals, sensors, or parallel interfaces without extensive external multiplexing.
• Industrial Reliability:  Device rated for –40 °C to 100 °C operation for deployments in demanding industrial environments.
• Space‑Efficient Packaging:  1760‑FBGA (42.5 × 42.5 mm) FCBGA package delivers high pin count in a compact footprint for dense board layouts.
• Regulatory Compatibility:  RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEB6R2F43I3N?

The 5SGXEB6R2F43I3N combines a high logic element count, substantial embedded RAM, and a large I/O complement in a 1760‑FBGA package, positioned for designs that demand consolidated programmable logic and broad connectivity within industrial operating conditions. Its low‑voltage core supply and RoHS compliance align with modern power and manufacturing practices.

This device is suitable for engineering teams designing complex, high‑density FPGA solutions for industrial systems, high‑throughput signal processing, and multi‑interface bridging where on‑chip resources and robust temperature operation are required. Its placement within the Stratix V GX family provides a foundation of device characteristics documented in the Stratix V device datasheet.

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