5SGXEB6R3F40C2

The 5SGXEB6R3F40C2 is a Stratix V GX family FPGA from Intel, delivered in a 1517-FBGA (40×40) surface-mount package for commercial applications. It combines high logic capacity, large on-chip memory, and extensive I/O to address demanding programmable-logic designs.

As a Stratix V GX device, the series supports high-speed transceiver speed grades (series-level) and a range of core speed grades, enabling designs that require high-density logic, abundant I/O, and high-speed serial connectivity. This part is specified for commercial temperature operation from 0°C to 85°C and is RoHS compliant.

Key Features

• High logic capacity — 597,000 logic elements (cells) to implement complex custom logic and parallel processing architectures.
• Large embedded memory — approximately 53.2 Mbits of on-chip RAM for buffering, caching, and state storage.
• Extensive I/O — 432 user I/Os to support multiple interfaces, external memory buses, and dense peripheral connectivity.
• Transceiver speed grades (series-level) — Stratix V GX devices include transceiver grades supporting channel rates up to 14.1 Gbps, suitable for high-speed serial link designs.
• Power rails — Core voltage supply range specified at 0.870 V to 0.930 V, enabling defined power budgeting for core logic.
• Commercial grade and thermal — Rated for 0°C to 85°C operating temperature range for commercial deployments.
• Package and mounting — 1517-FBGA (40×40) supplier device package in a surface-mount form factor for compact board integration.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-speed serial links — Implement multi-gigabit serial interfaces using the Stratix V GX transceiver speed grades.
• Large-scale logic designs — Deploy complex custom logic and parallel processing functions leveraging 597,000 logic elements.
• On-chip buffering and memory-heavy functions — Use approximately 53.2 Mbits of embedded memory for packet buffering, FIFOs, and data staging.
• Dense I/O integration — Connect multiple peripherals, external memories, and interfaces using 432 user I/Os.

Unique Advantages

• Highly integrated programmable fabric: 597,000 logic elements enable large designs without immediate need for multi-device partitioning.
• Substantial on-chip memory: Approximately 53.2 Mbits of RAM reduces reliance on external memory for many buffering and state-storage tasks.
• Robust I/O density: 432 I/Os simplify board-level routing and enable rich peripheral and interface support from a single device.
• Defined power envelope: Core supply range of 0.870–0.930 V supports predictable power budgeting and thermal planning.
• Commercial temperature rating: Designed for systems operating within 0°C to 85°C, aligning with many commercial deployments.
• Compact package: 1517-FBGA (40×40) surface-mount package supports high-density PCB layouts in space-constrained designs.

Why Choose 5SGXEB6R3F40C2?

The 5SGXEB6R3F40C2 delivers a balanced combination of large logic capacity, substantial embedded memory, and plentiful I/O in a compact 1517-FBGA package. Its specifications make it suitable for commercial designs that require high-density programmable logic and high-speed serial capabilities as offered by the Stratix V GX series.

Backed by Intel’s Stratix V family documentation and defined electrical characteristics, this device is appropriate for teams seeking a high-capacity FPGA platform with clear power, thermal, and I/O specifications for system-level planning.

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