5SGXEB6R3F40C2G

The 5SGXEB6R3F40C2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1517-FBGA (40×40) package. This commercial-grade device delivers large programmable logic capacity, substantial on-chip RAM, and a high I/O count for designs that require extensive custom logic and memory resources.

Key value is provided through a combination of high logic element count, approximately 53.25 Mbits of embedded RAM, and 432 user I/Os, making the device suitable for systems that need dense logic fabric and significant local memory in a surface-mount BGA package.

Key Features

• Logic Capacity  Approximately 597,000 logic elements to implement large, complex designs and custom processing pipelines.
• Logic Array Blocks (LABs)  225,400 LABs to organize and structure large logic designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• High I/O Count  432 device I/Os for dense board-level connectivity and multiple parallel interfaces.
• Package & Mounting  1517-FBGA (40×40) package, surface-mount, for compact board integration and high-density routing.
• Power Supply  Specified voltage supply range of 870 mV to 930 mV.
• Operating Range  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density custom logic systems  Implement large custom datapaths, accelerators, or protocol engines using the device’s substantial logic element capacity.
• Memory-intensive processing  Use the approximately 53.25 Mbits of embedded RAM for buffering, caches, and local data storage in compute-heavy applications.
• I/O-rich platform integration  Leverage 432 I/Os for multi-channel interfaces, parallel data streams, and board-level system interconnects.

Unique Advantages

• Extensive programmable logic: High logic element count enables implementation of large, multi-function designs without splitting across devices.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependence and lowers system latency.
• Dense I/O capability: 432 I/Os support complex connectivity requirements and parallel interface implementations.
• Surface-mount, high-density package: 1517-FBGA (40×40) provides a compact footprint for space-constrained boards while enabling high routing density.
• Commercial temperature grade: Specified 0 °C to 85 °C range for standard commercial deployments.
• RoHS compliant: Meets common restriction-of-hazardous-substances requirements for environmental compliance.

Why Choose 5SGXEB6R3F40C2G?

The 5SGXEB6R3F40C2G positions itself for designs that demand large programmable logic resources, substantial on-chip RAM, and high I/O density within a compact FBGA package. Its commercial-grade specification and defined voltage and temperature ranges make it appropriate for mainstream electronic systems needing scalable logic and memory integration.

Engineers and system designers benefit from the device’s combination of logic capacity, embedded memory, and I/O resources to consolidate functionality, reduce external component count, and streamline board-level integration while maintaining compliance with RoHS requirements.

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