5SGXEB6R2F43I3LN

The 5SGXEB6R2F43I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1760-BBGA / 1760-FCBGA package. This industrial-grade device delivers high logic density, large on‑chip RAM, and extensive I/O suitable for complex digital designs and system-level integration.

Designed for applications that require significant embedded memory and extensive connectivity, the device combines 597,000 logic elements with approximately 53 Mbits of embedded memory and up to 600 I/O pins, while operating across a wide industrial temperature range.

Key Features

• Core Logic Density 597,000 logic elements for large-scale digital integration and complex logic implementations.
• Embedded Memory Approximately 53 Mbits of on‑chip RAM to support large buffering, frame storage, and memory‑intensive processing.
• I/O Capacity Up to 600 I/O pins to support high-channel-count interfacing and complex system routing requirements.
• Package 1760-BBGA / 1760-FCBGA footprint (supplier device package: 1760-FCBGA (42.5x42.5)) for high‑pin‑count, board‑level integration; surface-mount mounting type.
• Power Core voltage supply range of 820 mV to 880 mV, allowing precise core power provisioning aligned with system power design.
• Industrial Temperature Grade Rated for operation from -40°C to 100°C, supporting deployment in industrial environments.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital processing — Implements large combinational and sequential logic designs that require significant logic-element counts and embedded memory.
• Multi-channel I/O systems — Suited for systems that need hundreds of I/O connections for data aggregation, routing, or parallel interfaces.
• Industrial control and automation — Industrial temperature rating and high integration density support controller and real‑time processing functions in industrial equipment.

Unique Advantages

• Exceptional logic capacity: 597,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Large on‑chip memory: Approximately 53 Mbits of embedded RAM supports buffering and data‑intensive algorithms without relying solely on external memory.
• High I/O count: Up to 600 I/O pins provide flexibility for dense interfaces, sensor arrays, or multi-channel data acquisition systems.
• Industrial robustness: -40°C to 100°C operating range allows deployment in a wide range of industrial environments.
• High‑pin package for system integration: 1760-FCBGA/BBGA package supports high connectivity and compact PCB layouts for complex systems.
• Standards‑conscious manufacturing: RoHS compliance for regulatory and supply-chain compatibility.

Why Choose 5SGXEB6R2F43I3LN?

The 5SGXEB6R2F43I3LN positions itself for designs that require substantial logic resources, significant embedded RAM, and a very large I/O complement in an industrial-grade FPGA. Its combination of 597,000 logic elements, approximately 53 Mbits of on‑chip memory, and up to 600 I/Os makes it suitable for integrating multiple subsystems onto a single device, simplifying board-level architecture and reducing part count.

Backed by the Stratix V family documentation, this Intel-sourced FPGA provides a documented platform for developers and system integrators seeking a high-density, industrial-rated programmable device for demanding applications where integration, memory capacity, and I/O reach are primary considerations.

Request a quote or submit an inquiry to purchase the 5SGXEB6R2F43I3LN for your next high-density FPGA design project.