5SGXEB6R2F43I3LG

The 5SGXEB6R2F43I3LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, supplied in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package. It integrates a large logic fabric, substantial on‑chip RAM, and a high I/O count to address complex, high-density logic implementations in industrial environments.

Designed for industrial temperature operation, this device provides a combination of logic capacity, embedded memory, and I/O resources suitable for designs that require significant integration in a single FPGA package.

Key Features

• Core Logic — Approximately 597,000 logic elements and 225,400 logic array blocks (LABs) for dense, programmable logic implementation.
• Embedded Memory — Approximately 53.25 Mbits of embedded RAM to support large on‑chip buffering, caches, and data-path storage.
• I/O Resources — 600 user I/O pins to support a wide range of external interfaces and parallel connectivity.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for compatibility with target power architectures.
• Package & Mounting — 1760-FCBGA (1760-BBGA) package case, 42.5 × 42.5 mm, surface-mount mounting type for high-density board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Compliance — RoHS compliant.
• Documentation — Supported by the Stratix V device datasheet covering electrical and switching characteristics for the Stratix V family.

Typical Applications

• High-density logic implementations — Use the ~597,000 logic elements for complex finite-state machines, custom pipelines, and large-scale logic functions.
• Memory‑intensive designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet processing, or on‑chip data storage.
• Systems requiring extensive I/O — 600 I/O pins enable broad external interfacing and parallel connectivity for industrial controllers and communication modules.
• Industrial equipment — The −40 °C to 100 °C operating range supports deployment in industrial environments that require extended temperature capability.

Unique Advantages

• High logic density: Nearly 600k logic elements enable consolidation of large designs into a single FPGA, reducing board-level partitioning.
• Substantial on‑chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependency on external memory for many data-path and buffering needs.
• Extensive I/O: 600 user I/O pins provide flexibility for diverse interface requirements without additional multiplexing hardware.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature‑variable environments.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package supports dense PCB layouts while providing the connectivity needed for complex systems.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 5SGXEB6R2F43I3LG?

This Intel Stratix V GX FPGA combines a large logic fabric, significant embedded memory, and a high I/O count in a single industrial-grade FCBGA package. It is positioned for designs that require consolidated logic and memory resources with robust temperature capability.

Engineers specifying this device benefit from measurable on‑chip capacity and the availability of detailed Stratix V documentation for electrical and switching characteristics, aiding design validation and system integration.

Request a quote or submit your design requirements to receive pricing and availability information for the 5SGXEB6R2F43I3LG.