5SGXEB6R2F43I2N

The 5SGXEB6R2F43I2N is a Stratix V GX field programmable gate array (FPGA) IC from Intel. It delivers very high logic capacity and on-chip memory in a 1760-FCBGA package, targeting designs that require dense logic placement, substantial embedded RAM, and a large I/O footprint.

With industrial-grade qualification and an extended operating temperature range, this device is suited for systems that demand robustness across temperature extremes while integrating significant logic, memory, and I/O resources on a single FPGA.

Key Features

• Logic Capacity — 597,000 logic elements (LEs) to support complex, high-density digital designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for memory-intensive implementations and reduced dependency on external memory.
• I/O Resources — 600 user I/Os to enable high-channel-count interfaces and broad system connectivity.
• Package & Mounting — 1760-BBGA (FCBGA) package; supplier package listed as 1760-FCBGA with a 42.5 × 42.5 mm footprint; surface-mount device for standard PCB assembly.
• Power — Core voltage supply range specified at 870 mV to 930 mV for compatibility with low-voltage core power rails.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic capacity to integrate complex signal processing, protocol handling, and custom logic blocks within a single device.
• Memory-intensive FPGA designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, on-chip data storage, and algorithm acceleration without immediate need for external DRAM.
• High-I/O interface hubs — 600 I/Os accommodate multi-channel interfaces, sensor arrays, and parallel connectivity in communications and instrumentation designs.
• Industrial control and instrumentation — Industrial temperature rating and robust packaging support deployment in environmental and factory-floor applications.

Unique Advantages

• High integration density: 597,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM helps minimize external memory needs and streamlines system BOM.
• Extensive I/O: 600 I/Os provide flexibility for interfacing many peripherals or parallel channels without external multiplexing logic.
• Industrial robustness: Industrial grade and −40 °C to 100 °C operating range support deployment in temperature-challenging environments.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) delivers high pin density in a surface-mount footprint suitable for modern PCB assembly.
• RoHS compliance: Conforms to RoHS requirements for environmentally constrained product designs.

Why Choose 5SGXEB6R2F43I2N?

The 5SGXEB6R2F43I2N positions itself where very high logic capacity, significant embedded memory, and large I/O counts are required within an industrial-grade FPGA platform. Its combination of 597,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 600 I/Os makes it suitable for complex, compact system designs that benefit from high integration.

Manufactured by Intel and delivered in a 1760-FCBGA surface-mount package with an industrial temperature rating and RoHS compliance, this device offers a balanced solution for engineers building memory- and I/O-intensive systems that must operate reliably across wide temperature ranges.

Request a quote or submit an inquiry to check availability and pricing for the 5SGXEB6R2F43I2N FPGA and to discuss how it can fit into your next high-density or industrial design.