5SGXEB6R2F43I2LN

The 5SGXEB6R2F43I2LN is a Stratix® V GX family field-programmable gate array (FPGA) in a 1760-ball FCBGA package, offered by Intel. It delivers large programmable logic capacity, substantial on-chip memory, and a high I/O count for demanding embedded and industrial designs.

Designed for industrial-temperature operation, this device targets high-density logic implementations and systems that require significant embedded RAM and extensive I/O while operating within a low-voltage core supply range.

Key Features

• High Logic Capacity  Provides 597,000 logic elements for complex programmable logic and large-scale integration.
• Embedded Memory  Includes approximately 53 Mbits of on-chip RAM to support data buffering, packet processing, and deep on-chip storage.
• Extensive I/O  Up to 600 I/O pins allow broad connectivity to external devices, peripherals, and high-speed interfaces.
• Low-Voltage Core Operation  Core supply voltage range of 820 mV to 880 mV for operation within specified power rails.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
• Package and Mounting  1760-ball FCBGA (1760-BBGA) surface-mount package; supplier package dimensions: 1760-FCBGA (42.5 × 42.5 mm).
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use the industrial temperature rating and large logic capacity for programmable controllers, motor drives, and factory automation systems.
• High-Density Signal Processing  Leverage the 597,000 logic elements and approximately 53 Mbits of embedded RAM for DSP, image processing, and real-time data pipelines.
• Communications and Networking Equipment  High I/O count supports interface aggregation, packet handling, and board-level connectivity in networking appliances.

Unique Advantages

• High integration density: The large logic element count enables consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM allow for extensive buffering and state storage without external memory.
• Broad connectivity: 600 I/O pins provide flexibility to connect numerous peripherals and interface standards on a single FPGA.
• Industrial robustness: Rated for -40 °C to 100 °C operation to meet the demands of harsh industrial environments.
• Compact FCBGA footprint: 1760-FCBGA (42.5 × 42.5 mm) package offers a high-pin-count solution in a defined board area.
• RoHS compliant: Meets regulatory requirements for lead-free assembly and environmental compliance.

Why Choose 5SGXEB6R2F43I2LN?

The 5SGXEB6R2F43I2LN positions itself as a high-density, industrial-grade FPGA option within the Stratix V GX family, combining a very large logic fabric, significant embedded memory, and a high I/O count in a 1760-FCBGA package. Its low-voltage core operation and extended temperature range make it suitable for robust, long-life systems that demand on-device capacity and connectivity.

This device is well suited for engineering teams building complex signal-processing, networking, or industrial control systems that require scalable logic resources and substantial on-chip RAM while adhering to industrial environmental requirements.

Request a quote or submit an RFQ to learn about availability, pricing, and lead times for the 5SGXEB6R2F43I2LN.