5SGXEB6R2F43I2L

The 5SGXEB6R2F43I2L is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1760-ball FCBGA package. It delivers a high logic capacity and extensive I/O resources suited to demanding embedded and communications-oriented designs.

Designed for industrial-grade operation, this device combines approximately 53.25 Mbits of embedded RAM, up to 597,000 logic elements, and 600 I/O pins to support complex, high-density implementations where large on-chip memory and high I/O count are required.

Key Features

• Core Logic Capacity  Provides 597,000 logic elements to implement large-scale custom logic, datapaths, and state machines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, look-up tables, and embedded data storage.
• I/O Density  600 I/O pins for broad connectivity to external peripherals, interfaces, and high-pin-count mezzanine designs.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV for operation within defined power domains.
• Package & Mounting  1760-FCBGA (42.5 × 42.5) package, surface-mount mounting type suitable for high-density PCB integration.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C, enabling use in extended-temperature environments.
• Standards Compliance  RoHS compliant to support regulatory and manufacturing requirements.
• Stratix V Family Characteristics  As a Stratix V GX-class device, the series datasheet documents electrical and switching characteristics and transceiver speed grade information for the family.

Typical Applications

• High-density networking and telecom equipment  Large logic and memory resources plus extensive I/O make the device suitable for packet processing, protocol offload, and aggregation functions.
• Data center acceleration  On-chip memory and logic capacity can be used for custom acceleration engines and data-path implementations.
• Industrial systems  Industrial-grade temperature range and high I/O count support control systems, automation gateways, and ruggedized embedded platforms.

Unique Advantages

• High logic density: 597,000 logic elements enable implementation of complex designs without external FPGA partitions.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and lookup requirements.
• Large I/O footprint: 600 I/Os provide flexibility for multi-channel interfaces and high-pin-count peripheral connectivity.
• Industrial temperature tolerance: Rated –40 °C to 100 °C to support deployments in extended-temperature environments.
• Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5) surface-mount package balances high I/O and manufacturability for production PCB assembly.
• Regulatory readiness: RoHS compliance simplifies material-conformance considerations for product development.

Why Choose 5SGXEB6R2F43I2L?

The 5SGXEB6R2F43I2L positions itself where high logic capacity, significant embedded memory, and a large number of I/Os are required in an industrial-rated FPGA. Its Stratix V GX-class heritage ensures documented electrical and switching characteristics suitable for complex communications and compute-centric designs.

This device is ideal for design teams needing a scalable, high-density FPGA platform for networking, data-path acceleration, and industrial embedded systems where on-chip memory and I/O density reduce external component count and simplify board-level design.

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