5SGXEB6R2F43C3

The 5SGXEB6R2F43C3 is a Stratix® V GX field programmable gate array (FPGA) in a 1760-FCBGA (42.5 × 42.5 mm) package. It delivers large on-chip logic and memory capacity with extensive I/O for complex, high-density digital designs.

Key device attributes include 597,000 logic elements, approximately 53.248 Mbits of embedded memory, up to 600 I/O pins, a commercial operating temperature range of 0 °C to 85 °C, a core supply window of 820 mV to 880 mV, and surface-mount FCBGA packaging. The device is RoHS compliant.

Key Features

• Core Logic  597,000 logic elements provide large programmable logic capacity for complex combinational and sequential designs.
• On-chip Memory  Approximately 53.248 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
• I/O Density  Up to 600 I/O pins support broad external interfacing for multi-channel systems and high-pin-count designs.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power rails and allow optimized power planning.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount format for board-level integration in compact, high-density layouts.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-density digital processing  Large logic element count and embedded RAM make this FPGA suitable for complex processing pipelines and custom accelerators.
• Multi‑I/O systems  Up to 600 I/Os enable integration of multiple peripherals, sensors, and interfaces in communications and instrumentation equipment.
• Network and communications modules  Stratix V GX family FPGA in a high-pin-count package supports designs that require extensive I/O and on-chip memory for packet buffering and protocol logic.
• Prototype and advanced embedded systems  Surface-mount FCBGA packaging and large logic/memory resources support development of feature-rich embedded platforms.

Unique Advantages

• Substantial programmable capacity: 597,000 logic elements let engineers implement large-scale logic and complex state machines without external ASICs.
• Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• High I/O count: Up to 600 I/Os simplify board-level routing for multi-channel and multi-interface designs.
• Compact high-density package: 1760-FCBGA (42.5 × 42.5 mm) allows high pin counts in a manufacturable surface-mount form factor.
• Commercial-grade thermal range: Rated 0 °C to 85 °C for a wide set of controlled-environment applications.
• RoHS compliant: Supports lead-free assembly and regulatory compliance for modern manufacturing.

Why Choose 5SGXEB6R2F43C3?

The 5SGXEB6R2F43C3 provides a combination of large programmable logic, substantial embedded memory, and high I/O density in a single commercial-grade FCBGA package. This makes it well suited for engineers designing complex digital systems that require integrated resources and a high pin count in a surface-mount form factor.

For teams focused on scalable, high-capacity FPGA implementations, this Stratix V GX device offers a clear, verifiable specification set—logic elements, embedded memory, I/O count, supply window, and thermal grade—that supports informed system-level decisions and reliable board integration.

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