5SGXEB6R2F43C3G

The 5SGXEB6R2F43C3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in a commercial temperature grade. It delivers very high logic capacity and embedded memory in a high‑pin‑count FCBGA package, making it suitable for designs that require dense programmable logic, extensive on‑chip RAM, and a large number of I/O connections.

As a Stratix V GX device, this family’s electrical and switching characteristics are documented in the device datasheet; Stratix V GX devices include transceiver speed grade options reported in the series documentation. The device’s combination of logic resources, on‑chip memory, and I/O density supports complex, high‑integration FPGA designs.

Key Features

• Logic Capacity — 597,000 logic elements to implement large, performance‑oriented designs and complex custom logic.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for buffering, LUTs, and large state storage without external memory.
• I/O Density — 600 I/Os to support extensive peripheral connectivity and multiple parallel interfaces.
• Package — 1760‑FBGA (1760‑FCBGA / 1760‑BBGA) with supplier package dimension 42.5 × 42.5 mm for high pin‑count board layouts and dense integration.
• Power Supply — Core supply range of 820 mV to 880 mV, enabling precise core power provisioning in system designs.
• Mounting & Compliance — Surface mount FCBGA device; RoHS‑compliant for global electronics manufacturing.
• Commercial Temperature Grade — Rated operating temperature from 0 °C to 85 °C for standard commercial environments.
• Series Documentation — Electrical and switching characteristics for the Stratix V family are provided in the device datasheet covering operating conditions, power, and I/O timing.

Typical Applications

• High‑capacity FPGA designs — Implement large custom logic functions and complex state machines using the device’s high logic element count and embedded RAM.
• Data buffering and packet processing — Use the substantial on‑chip memory for frame buffering, FIFOs, and packet manipulation without immediate external memory dependence.
• Multi‑interface systems — Support systems requiring many parallel or serialized interfaces with the device’s 600 I/Os and high pin count package.

Unique Advantages

• High logic integration: 597,000 logic elements reduce the need for multi‑device partitioning and simplify board complexity.
• Large embedded memory: Approximately 53.25 Mbits of on‑chip RAM enables extensive buffering and local data storage, lowering external memory requirements.
• Extensive I/O availability: 600 I/Os provide flexibility for mixed signals, parallel buses, and numerous peripheral connections on a single device.
• Compact, high‑pin package: The 1760‑FCBGA (42.5 × 42.5 mm) package concentrates I/O and resources into a manageable PCB footprint for dense system designs.
• Compliance and manufacturability: Surface mount FCBGA and RoHS compliance align with standard commercial manufacturing processes.

Why Choose 5SGXEB6R2F43C3G?

The 5SGXEB6R2F43C3G positions itself for designers who need substantial programmable logic, significant on‑chip memory, and wide I/O capability in a single commercial‑grade FPGA. Its Stratix V GX lineage is documented with detailed electrical and switching characteristics, enabling engineers to plan for power, I/O timing, and transceiver options as covered in the series datasheet.

This combination of logic density, embedded RAM, and I/O count makes the device well suited to high‑integration FPGA implementations where reducing board count and simplifying interconnect are priorities. The device’s package and RoHS compliance support standard surface‑mount assembly and commercial manufacturing workflows.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEB6R2F43C3G and to discuss how this Stratix® V GX FPGA can fit your next high‑density programmable logic design.