5SGXEB6R2F43C2LN

The 5SGXEB6R2F43C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) delivered in a 1760-FCBGA surface-mount package. Built for high-density, high-throughput designs, it provides a large fabric of logic and embedded memory suitable for advanced communications, compute, and signal-processing applications.

This commercial-grade device features 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 I/Os, offering the integration and interface density required for complex system designs while operating within a core voltage window of 820 mV to 880 mV.

Key Features

• Core Density  597,000 logic elements to implement large-scale logic, custom datapaths, and complex state machines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, LUT-based storage, and fast local data access.
• I/O Capability  600 I/Os to support dense board-level connectivity and multiple parallel interfaces.
• Transceiver Series Capability  As a Stratix V GX family device, the series supports transceiver speed grades documented for the family (series-level specification), enabling high-speed serial links where applicable.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) ball-grid array in a surface-mount form factor for compact, high-pin-count board designs.
• Power Envelope  Core supply range of 820 mV to 880 mV to match system power-rail planning and power-management strategies.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-Speed Communications  Dense logic and series transceiver support make this device suitable for packet processing, switching fabrics, and protocol bridging.
• Signal Processing  Large embedded RAM and high logic density support DSP pipelines, real-time filtering, and data aggregation tasks.
• Hardware Acceleration  Custom acceleration engines for compute or encryption workloads benefit from the available logic capacity and on-chip memory.
• Prototyping & System Integration  High I/O count and a compact FCBGA package enable complex board-level integration and rapid prototyping of multi-interface systems.

Unique Advantages

• High integration density: 597,000 logic elements and ~53.25 Mbits of embedded RAM reduce the need for external ASIC/FPGA cascades and external memory in many designs.
• Extensive I/O resources: 600 I/Os provide flexibility to implement multiple interfaces and parallel buses without extensive routing compromises.
• Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) supports high-pin-count designs in a surface-mount form factor suitable for production assembly.
• Power-aware core supply: 820 mV–880 mV core range enables controlled power budgeting and compatibility with low-voltage power delivery solutions.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation for typical commercial deployment environments.
• RoHS compliant: Facilitates environmental compliance for global manufacturing and distribution.

Why Choose 5SGXEB6R2F43C2LN?

The 5SGXEB6R2F43C2LN offers a balanced combination of logic capacity, embedded memory, and I/O density in a production-ready FCBGA package. Its Stratix V GX family characteristics and series-level transceiver capabilities align with designs that require substantial on-chip resources and high-bandwidth interfacing.

This part is aimed at engineering teams building advanced communications, signal processing, and hardware-accelerated systems that need a high-density FPGA with predictable power and temperature characteristics and RoHS compliance for manufacturability.

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