5SGXEB6R2F43C2LG

The 5SGXEB6R2F43C2LG is a Stratix V GX family FPGA in a 1760-ball FCBGA package, designed for commercial applications that require large programmable logic capacity, extensive on-chip memory, and high I/O density. As a member of the Stratix V GX family, this device targets designs that need substantial logic resources and flexible interfacing within the commercial temperature range.

Key value propositions are its high logic capacity, abundant embedded RAM, and a large number of I/O pins—all delivered in a surface-mount 1760-FCBGA (42.5 × 42.5 mm) package with RoHS compliance and a defined core voltage window for system-level power planning.

Key Features

• Core Logic Capacity  597,000 logic elements provide extensive programmable logic for complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and on-device data storage.
• I/O Density  600 user I/O pins support dense external connectivity and parallel interfaces.
• Package & Mounting  1760-FCBGA package (42.5 × 42.5 mm), surface-mount assembly suitable for compact, high-density PCB layouts.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to guide power-supply design and sequencing.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant.
• Stratix V GX Family Transceiver Capability (series-level)  Stratix V GX devices are offered in transceiver speed grades documented in the device datasheet; consult the datasheet for device-specific transceiver options and speed grades.

Typical Applications

• High-density logic systems  Designs that require hundreds of thousands of logic elements for complex hardware acceleration and custom datapaths.
• On-chip memory-intensive functions  Systems needing substantial embedded RAM for buffering, packet processing, or intermediate data storage.
• High I/O-count interfaces  Applications that demand many parallel or mixed-signal interfaces, leveraging up to 600 I/Os for external connectivity.
• Compact system integration  Deployments where a high-capacity FPGA must fit into a compact FCBGA footprint on a surface-mount PCB.

Unique Advantages

• Large programmable fabric: 597,000 logic elements enable implementation of complex algorithms and large custom hardware blocks without immediate off-chip resources.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduce reliance on external memory for many buffering and state-holding needs.
• High I/O count: 600 I/Os simplify system-level integration by supporting multiple parallel buses, external peripherals, and high pin-count interfaces.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) offers a dense, manufacturable form factor for space-constrained boards.
• Defined power footprint: Explicit core supply range (820 mV–880 mV) supports predictable power delivery and thermal planning.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation, suited to standard commercial environments.

Why Choose 5SGXEB6R2F43C2LG?

The 5SGXEB6R2F43C2LG combines substantial logic capacity, plentiful on-chip RAM, and a very high I/O count in a single surface-mount FCBGA package. This configuration makes it well-suited for commercial designs that need programmable hardware density and flexible external connectivity while maintaining a compact PCB footprint and clearly defined power and thermal parameters.

Engineers selecting this device benefit from the Stratix V GX family architecture and documented series-level transceiver capabilities (see the device datasheet for details), making this part appropriate for scalable, high-capacity FPGA implementations in commercial electronic systems.

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