5SGXEB6R2F43C2L

The 5SGXEB6R2F43C2L is a Stratix V GX field programmable gate array (FPGA) from Intel, supplied in a 1760-FCBGA (1760-BBGA) package. It delivers high logic density, substantial on-chip memory, and a large I/O count in a commercial-grade, surface-mount footprint.

This device is aimed at designers requiring dense programmable logic and significant embedded RAM capacity within a compact BGA package, with operating and power parameters specified for commercial electronic systems.

Key Features

• High logic capacity — 597,000 logic elements for complex programmable designs and large-scale logic integration.
• On-chip memory — Total RAM bits: 53,248,000, providing approximately 53.25 Mbits of embedded memory for buffering and data processing.
• Extensive I/O — 600 user I/O pins to support multiple interfaces and dense interconnect requirements.
• Package and mounting — 1760-FCBGA (supplier device package: 1760-FCBGA, 42.5×42.5 mm) / 1760-BBGA package case; surface-mount mounting type for board-level integration.
• Core supply range — Specified voltage supply from 820 mV to 880 mV for the device core.
• Commercial temperature grade — Rated operating temperature 0°C to 85°C (commercial grade).
• RoHS compliant — Conforms to RoHS environmental requirements.
• Documented family characteristics — Part of the Stratix V GX family with published device datasheet covering electrical and switching characteristics.

Typical Applications

• High-density programmable logic systems — Use the 597,000 logic elements and large embedded RAM to implement complex state machines, wide datapaths, and parallel processing blocks.
• High-channel interface designs — Leverage up to 600 I/Os to connect multiple interfaces, sensors, or peripheral lanes on a single FPGA.
• Commercial embedded electronics — Commercial temperature rating (0°C to 85°C) and surface-mount FCBGA package suit standard commercial embedded applications.

Unique Advantages

• High logic density: Enables large-scale programmable logic implementations without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces reliance on external memory for buffering and on-chip data storage.
• Broad I/O capability: 600 I/O pins provide flexibility for multi-protocol designs and high channel counts.
• Compact FCBGA footprint: 1760-FCBGA (42.5×42.5 mm) allows integration into space-constrained boards while keeping connections dense.
• Commercial operating range: Specified 0°C to 85°C range aligns with standard commercial device deployment.
• Regulatory readiness: RoHS compliance supports environmental regulatory requirements for commercial products.

Why Choose 5SGXEB6R2F43C2L?

The 5SGXEB6R2F43C2L positions itself as a high-capacity, commercially rated Stratix V GX FPGA suited for designs that demand large logic resources, significant embedded RAM, and a high I/O count in a single device. Its 1760-FCBGA surface-mount package and defined core supply and temperature ranges make it a practical choice for commercial electronic systems needing dense, programmable hardware.

As a member of the Stratix V GX family, this device is supported by published device documentation covering electrical and switching characteristics, enabling informed integration into complex designs where predictable electrical performance and board-level packaging are important.

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