5SGXEB6R2F43C1G

The 5SGXEB6R2F43C1G is a Stratix V GX Field Programmable Gate Array (FPGA) IC in a 1760‑FBGA FCBGA package. It provides a high logic element count, substantial on‑chip RAM, and a large I/O count for commercial‑grade designs that require dense digital integration and extensive interfacing.

This device is suited to commercial applications that demand high logic density, significant embedded memory, and a high number of I/O signals, while operating within a commercial temperature range and low core voltage.

Key Features

• Core Logic  Approximately 597,000 logic elements for complex digital implementations and large-scale programmable logic designs.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support large buffers, tables, and data‑intensive algorithms.
• I/O Capacity  600 programmable I/O pins to support high channel counts and extensive peripheral and board-level interfacing.
• Power  Core supply range of 870 mV to 930 mV, enabling low‑voltage core operation consistent with Stratix V GX family requirements.
• Package & Mounting  1760‑FBGA (1760‑FCBGA, 42.5 × 42.5 mm) surface‑mount package for high‑density board layouts.
• Commercial Grade Temperature  Rated for 0 °C to 85 °C operation for standard commercial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density digital systems  Implement complex state machines, large‑scale logic fabrics, and multi‑function ASIC replacements where abundant logic elements are required.
• Data buffering and on‑chip memory tasks  Use the device’s substantial embedded RAM for packet buffering, lookup tables, and temporary storage in data‑centric designs.
• High‑pin‑count interfacing  Leverage 600 I/Os for systems requiring many parallel interfaces, board‑level control, or extensive sensor/actuator connectivity.

Unique Advantages

• High logic density: The large logic element count supports complex algorithms and multi‑module designs without immediate need for device partitioning.
• Significant on‑chip RAM: Approximately 53.25 Mbits of embedded memory reduces external memory dependency and simplifies board design.
• Extensive I/O capability: 600 I/Os provide flexibility for high channel counts, parallel interfaces, and rich system connectivity.
• Compact FCBGA package: The 1760‑FCBGA (42.5 × 42.5 mm) package delivers high pin density in a manageable board footprint for commercial products.
• Commercial temperature rating: Rated for 0 °C to 85 °C to match standard commercial deployment environments.
• Regulatory compliance: RoHS compliance supports lead‑free manufacturing requirements.

Why Choose 5SGXEB6R2F43C1G?

The 5SGXEB6R2F43C1G positions itself as a high‑capacity Stratix V GX FPGA for commercial designs that require large programmable logic resources, ample embedded memory, and a high number of I/Os in a compact FCBGA footprint. Its low core voltage range and commercial temperature rating make it suitable for conventional electronics and high‑integration boards where on‑chip resources reduce BOM complexity.

Designers targeting scalable, memory‑rich, and I/O‑heavy applications will find this device well suited for consolidating functions, accelerating development timelines, and supporting complex digital architectures within commercial environments.

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