5SGXEB6R2F40I3N

The 5SGXEB6R2F40I3N is a Stratix® V GX field programmable gate array delivered in a 1517‑FBGA (40×40) surface‑mount package. It provides high-density programmable logic and on-chip memory targeted for industrial applications that require substantial logic capacity, abundant I/O, and extended temperature operation.

With approximately 597,000 logic elements, roughly 53.25 Mbits of embedded memory, and 432 user I/O, this device is suited to designs that need significant programmable resources and robust environmental tolerance.

Key Features

• Core Logic  Approximately 597,000 logic elements to implement large-scale custom logic and complex datapaths.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, packet processing, or large state machines without relying solely on external memory.
• I/O Capability  432 user I/O pins providing broad external interfacing options for peripherals, sensors, and high‑density board connections.
• Package & Mounting  1517‑FBGA (40×40) surface‑mount package for compact board integration and reliable ball‑grid assembly.
• Power  Specified core supply range of 820 mV to 880 mV to align with the device’s power and core voltage requirements.
• Industrial Grade & Temperature Range  Industrial grade device rated for an operating temperature range of −40 °C to 100 °C, suitable for demanding environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use the device’s high logic count and extended temperature range to implement deterministic control, protocol bridging, and custom state machines in industrial systems.
• High‑Density Interface Aggregation  Leverage 432 I/O pins and substantial on‑chip RAM to aggregate and buffer multiple peripheral interfaces or sensor arrays.
• Embedded System Acceleration  Deploy large custom accelerators, packet processors, or timing‑sensitive logic leveraging the device’s logic and memory resources.

Unique Advantages

• High Logic Capacity: Approximately 597,000 logic elements enable implementation of complex, large‑scale programmable designs without immediate partitioning.
• Significant On‑Chip Memory: Roughly 53.25 Mbits of embedded RAM reduce dependency on external memory for buffering and state storage, simplifying board design.
• Large I/O Count: 432 user I/O provide flexibility for multi‑channel interfacing and high‑pin‑count peripheral connectivity.
• Industrial‑Grade Operation: Rated for −40 °C to 100 °C, making it suitable for systems exposed to wide temperature swings or harsher environments.
• Compact, Surface‑Mount Package: 1517‑FBGA (40×40) package enables dense board layouts while supporting standard surface‑mount assembly processes.
• RoHS Compliant: Meets RoHS environmental requirements for lead‑free assembly considerations.

Why Choose 5SGXEB6R2F40I3N?

The 5SGXEB6R2F40I3N positions itself as a high‑density, industrial‑grade Stratix V GX FPGA offering a balance of large programmable logic, substantial embedded memory, and extensive I/O in a compact FBGA package. Its specified voltage and temperature ranges make it appropriate for designs that must operate reliably in industrial environments while delivering significant on‑chip resources.

Choose this device for projects that demand scalable programmable capacity, ample on‑chip buffering, and a robust footprint for integration into industrial systems or other temperature‑sensitive applications.

Request a quote or submit an inquiry for availability and pricing to begin integrating the 5SGXEB6R2F40I3N into your next design.