5SGXEB6R2F40I3G

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 53248000 597000 1517-FBGA (40x40)

Quantity 865 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB6R2F40I3G – Stratix® V GX FPGA, Industrial Grade, 1517‑FBGA

The 5SGXEB6R2F40I3G is a Stratix® V GX field programmable gate array (FPGA) IC designed for applications requiring large programmable logic capacity and significant on-chip memory. This industrial-grade device combines a high count of logic elements with substantial embedded RAM and a broad I/O complement in a compact 1517‑FBGA (40×40) surface-mount package.

Key attributes include 597,000 logic elements, approximately 53.2 Mbits of embedded memory, 432 I/O, an 820 mV–880 mV core supply window, and an operating temperature range from −40 °C to 100 °C—specifications suited for demanding embedded and industrial designs.

Key Features

  • Core Logic 597,000 logic elements provide extensive programmable logic capacity for large designs and complex system integration.
  • Embedded Memory Approximately 53.2 Mbits of on-chip RAM to support data buffering, state machines, and memory‑intensive logic functions.
  • I/O 432 user I/O pins enable broad interfacing options for peripherals, buses, and system signals.
  • Power Core voltage supply range of 820 mV to 880 mV for specified device operation.
  • Package & Mounting 1517‑FBGA (40×40) supplier device package in a surface-mount form factor for compact board integration.
  • Temperature Range Industrial operating temperature from −40 °C to 100 °C for extended environmental tolerance.
  • Compliance RoHS compliant.

Unique Advantages

  • Large programmable fabric: 597,000 logic elements enable implementation of complex, high‑density designs without external logic expansion.
  • Significant on‑chip memory: Approximately 53.2 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
  • High I/O count: 432 I/O signals facilitate integration with multiple peripherals, interfaces, and high‑pin-count systems.
  • Industrial robustness: Rated for −40 °C to 100 °C operation to meet the demands of industrial environments.
  • Compact BGA footprint: 1517‑FBGA (40×40) enables dense board placement while supporting surface-mount assembly processes.
  • Environmental compliance: RoHS status supports regulatory and environmental requirements.

Why Choose 5SGXEB6R2F40I3G?

The 5SGXEB6R2F40I3G positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA suitable for designs that require extensive logic resources, substantial embedded memory, and a large number of I/O in a compact package. Its specified voltage range and wide operating temperature support reliable operation across a variety of industrial deployment scenarios.

Engineers and procurement teams seeking a programmable device with clear, verifiable specifications for large-scale logic, on‑chip RAM, and robust environmental ratings can evaluate this part for applications where integration density and operational stability are priorities.

If you would like pricing, availability, or to request a formal quote for 5SGXEB6R2F40I3G, submit an inquiry or request a quote through your preferred procurement channel.

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