5SGXEB6R2F40I2LN

The 5SGXEB6R2F40I2LN is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-FBGA (40×40) surface-mount package. It delivers high logic capacity and on‑chip memory in an industrial-grade device designed for demanding embedded designs.

With 597,000 logic elements, approximately 53.248 Mbits of embedded RAM, and 432 available I/Os, this device targets complex, I/O- and memory-intensive systems. The device is specified for industrial operation and supports a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 597,000 logic elements to implement large-scale programmable logic, state machines, and custom datapaths.
• Embedded Memory Approximately 53.248 Mbits of on-chip RAM for buffering, packet storage, and data processing without external memory dependence.
• I/O Density 432 I/Os to support extensive peripheral, sensor, and subsystem interfacing on a single FPGA.
• Power and Voltage Core supply range of 820 mV to 880 mV to match system power-rail design and regulator selection requirements.
• Package & Mounting 1517-FBGA (40×40) surface-mount package for high-density PCB integration and robust soldered attachment.
• Temperature & Grade Industrial grade device specified for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Series Transceiver Capability (Series-level) The Stratix V GX family includes high-speed transceiver options (series documentation cites GX channel capability up to 14.1 Gbps), enabling high-bandwidth serial links where required.
• Compliance RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• I/O‑intensive systems — Use the device’s 432 I/Os for dense sensor arrays, board-level interfacing, or complex digital I/O routing.
• Memory‑heavy processing — On‑chip RAM capacity supports packet buffering, local data caching, and intermediate storage for streaming algorithms.
• Industrial control and instrumentation — Industrial-grade temperature range and robust packaging suit factory automation, test equipment, and control systems.
• High‑speed serial link subsystems — Leverage Stratix V GX family transceiver capabilities for high-bandwidth serial communications and link aggregation designs.

Unique Advantages

• High logic density: 597,000 logic elements enable consolidation of large FPGA designs onto a single device, reducing board count.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM helps minimize external memory requirements and simplifies PCB layout.
• Extensive I/O: 432 I/Os provide flexible connectivity for complex system integration and peripheral interfacing.
• Industrial readiness: Specified −40 °C to 100 °C operating range and industrial grade designation support deployment in harsh environments.
• Compact, high-density package: 1517-FBGA (40×40) surface-mount package enables dense PCB integration while maintaining signal routing options.
• Regulatory compliance: RoHS compliance supports lead-free assembly and environmental manufacturing requirements.

Why Choose 5SGXEB6R2F40I2LN?

The 5SGXEB6R2F40I2LN positions itself as a high-capacity FPGA option within the Stratix V GX family, combining large logic resources, significant on‑chip memory, and a high I/O count in an industrial-grade package. These characteristics make it suitable for developers tackling complex, memory- and I/O-intensive applications that require reliable operation across extended temperature ranges.

Backed by Intel’s Stratix V device documentation and series-level transceiver capabilities, this part is appropriate for engineering teams seeking a scalable, high-density programmable logic device that integrates into mature design flows. Its combination of density, memory, and industrial specification supports long-term deployments and iterative design scaling.

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