5SGXEB6R2F40C3N

The 5SGXEB6R2F40C3N is a high-density Stratix® V GX FPGA from Intel designed for complex programmable logic implementations in commercial applications. It provides substantial on-chip resources—including 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 432 I/Os—delivered in a 1517‑FBGA (40×40) surface-mount package.

With a low-voltage core operating range of 820 mV to 880 mV and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that demand large logic capacity, significant embedded RAM, and extensive I/O connectivity while meeting RoHS compliance requirements.

Key Features

• Core Density  597,000 logic elements provide the capacity to implement complex, large-scale digital designs and deep logic pipelines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM supports large buffering, state storage, and memory-intensive logic functions.
• I/O Count  432 I/Os enable broad external connectivity for high-pin-count systems and dense board-level interfacing.
• Power Supply  Core voltage range of 820 mV to 880 mV allows for low-voltage operation consistent with modern power-optimized designs.
• Package & Mounting  1517-FBGA (40×40) supplier device package in a surface-mount form factor suitable for compact, high-density PCB layouts.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C for commercial applications.
• Environmental Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• High-density digital processing  Large-scale logic and embedded memory make this device suited for complex datapath implementations and packet or frame processing.
• Communication systems  Extensive I/O and Stratix V GX family heritage align with designs requiring high channel counts and dense external interfacing.
• Prototyping and system integration  High logic capacity and significant on-chip RAM support system-level prototyping and consolidation of multiple functions into a single FPGA.
• Custom hardware acceleration  Substantial logic and memory resources allow offloading compute-heavy kernels into dedicated FPGA logic for performance-oriented designs.

Unique Advantages

• High logic capacity: 597,000 logic elements enable implementation of large, feature-rich designs without partitioning across multiple devices.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory and improves throughput for memory-intensive tasks.
• Extensive I/O: 432 I/Os provide flexibility for wide parallel interfaces, multi-channel front-ends, and dense board-level connectivity.
• Low-voltage core operation: 820–880 mV supply range supports integration into power-sensitive systems and allows designers to optimize power delivery.
• Compact package: 1517‑FBGA (40×40) surface-mount package helps minimize PCB footprint while delivering high pin density.
• Commercial readiness: 0 °C to 85 °C operating range and RoHS compliance meet common commercial deployment requirements.

Why Choose 5SGXEB6R2F40C3N?

The 5SGXEB6R2F40C3N combines substantial logic density, large embedded memory, and a high I/O count in a compact 1517‑FBGA package—positioning it for demanding commercial FPGA designs that require consolidation of complex functions and extensive interfacing. Its low-voltage core range and RoHS compliance further support power-conscious, environmentally-compliant product designs.

This Stratix V GX device is suited for engineering teams building large-scale programmable logic solutions where on-chip resources and connectivity are critical. Its resource profile provides headroom for sophisticated algorithms, data buffering, and multi-interface systems while aligning with commercial temperature requirements.

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