5SGXEB6R2F40C2LN

The 5SGXEB6R2F40C2LN is a Stratix® V GX field programmable gate array (FPGA) IC designed for commercial‑grade programmable logic integration. As a high‑density Stratix V GX device, it provides a large logic fabric and substantial on‑chip memory to address I/O‑dense and memory‑intensive designs.

Key value comes from its combination of 597,000 logic elements, approximately 53 Mbits of embedded memory, and 432 user I/Os in a 1517‑FBGA (40×40) surface‑mount package. Detailed electrical and switching characteristics, including I/O timing and transceiver behavior for the Stratix V family, are documented in the Stratix V device datasheet.

Key Features

• Core & logic capacity  Provides 597,000 logic elements to implement large combinational and sequential logic networks.
• Embedded memory  Approximately 53 Mbits of on‑chip RAM for buffers, FIFOs, and memory‑intensive functions.
• I/O density  432 user I/Os to support wide parallel interfaces and complex board‑level connectivity.
• Package & mounting  1517‑FBGA (40×40) surface‑mount package for compact, board‑level integration.
• Power requirements  Core voltage supply range of 820 mV to 880 mV to match system power rails and design constraints.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory compliance  RoHS‑compliant manufacturing and materials.
• Product documentation  Stratix V device datasheet provides electrical and switching characteristics, I/O timing, and series‑level transceiver information.

Typical Applications

• I/O‑dense systems  Leverage 432 I/Os for multi‑lane interfaces and extensive peripheral connectivity.
• Memory‑intensive logic  Use the approximately 53 Mbits of embedded memory for buffering, packet processing, and data path storage.
• High‑density programmable logic  Deploy 597,000 logic elements for complex custom hardware acceleration and control logic in commercial products.

Unique Advantages

• High logic integration: 597,000 logic elements enable consolidation of large logic functions into a single FPGA, reducing external components.
• Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM supports deep buffering and complex state machines without external memory.
• Generous I/O count: 432 I/Os accommodate wide buses, parallel interfaces, and mixed signal I/O requirements on the same device.
• Compact FBGA package: 1517‑FBGA (40×40) surface‑mount package balances pin density and board space for compact system designs.
• Commercial operating range: 0 °C to 85 °C rating aligns with standard commercial product environments and qualification flows.
• Standards‑conscious supply: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEB6R2F40C2LN?

5SGXEB6R2F40C2LN positions itself as a high‑capacity Stratix V GX FPGA for commercial designs that require extensive logic resources, substantial embedded memory, and a high I/O count in a compact FBGA footprint. Its documented series‑level electrical and switching characteristics make it suitable for system designs that need predictable core and I/O behavior.

This part is well suited to engineering teams building complex, I/O‑rich programmable systems that benefit from consolidating functions into a single FPGA device while maintaining commercial temperature and RoHS compliance. The combination of logic density, on‑chip memory, and package density offers a scalable platform for demanding commercial applications.

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