5SGXEB6R2F40C2L

The 5SGXEB6R2F40C2L is a Stratix® V GX FPGA from Intel designed for commercial embedded and system-level applications. It integrates 597,000 logic elements and approximately 53.25 Mbits of on-chip RAM to support high-density logic and substantial on-chip buffering.

With 432 user I/Os in a 1517‑FBGA (40×40) surface-mount package and a core supply range of 820 mV to 880 mV, this device targets applications that require dense logic, abundant memory resources, and a high pin-count footprint within commercial temperature bounds (0 °C to 85 °C).

Key Features

• Core Capacity  Provides 597,000 logic elements to implement complex, high-density digital designs.
• Embedded Memory  Approximately 53.25 Mbits of total on-chip RAM for large buffers, FIFOs, and on-chip data storage.
• I/O  432 user I/O pins to support wide parallel interfaces, board-level connectivity, and multi-channel I/O routing.
• Power and Supply  Core supply voltage specified between 820 mV and 880 mV for precise power delivery requirements.
• Package & Mounting  1517‑FBGA (40×40) supplier device package in a surface-mount form factor for compact, high-pin-count PCB integration.
• Operating Range & Grade  Commercial grade operation with an ambient temperature rating of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmentally regulated BOMs and global manufacturing requirements.

Typical Applications

• Communications Equipment  High logic density and abundant on-chip memory make this FPGA suitable for packet processing, protocol bridging, and interface aggregation in commercial communications systems.
• Data Processing & Acceleration  Large logic and memory resources enable hardware acceleration and custom data-path implementations in compute and network appliances.
• High‑Pin‑Count Embedded Systems  The 432 I/Os and FBGA package simplify integration into compact, feature-rich embedded platforms requiring many peripheral connections.
• FPGA-Based Prototyping  Dense logic and sizable embedded RAM support complex prototype designs and system validation in commercial development environments.

Unique Advantages

• High Logic Density: 597,000 logic elements reduce the need for multiple devices and enable larger, more complex designs on a single FPGA.
• Substantial On-Chip Memory: Approximately 53.25 Mbits of RAM supports on-chip buffering and stateful processing without relying on external memory for many use cases.
• Extensive I/O Count: 432 I/Os facilitate wide parallel interfaces and flexible board-level partitioning, simplifying system I/O design.
• Compact, High-Pin Package: The 1517‑FBGA (40×40) surface-mount package delivers a high pin count in a compact footprint for dense PCB layouts.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, matching typical commercial product deployment environments.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and distribution requirements.

Why Choose 5SGXEB6R2F40C2L?

The 5SGXEB6R2F40C2L combines significant logic capacity, substantial embedded memory, and a high I/O count in a compact FBGA package—making it a strong choice for commercial applications that demand on-chip resources and board-level connectivity. Its defined core voltage range and commercial temperature rating provide clear platform constraints for power and thermal planning.

This device is suited for development teams and OEMs building medium- to high-complexity digital systems that benefit from integrated memory and large logic fabric while maintaining a compact, high-pin-count footprint. The Stratix V GX family datasheet supplies detailed electrical and switching characteristics for system design and validation.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the 5SGXEB6R2F40C2L.