5SGXEB6R2F40C2

The 5SGXEB6R2F40C2 is a Stratix® V GX family FPGA device offering very large programmable logic capacity, high on‑chip memory, and a substantial I/O count in a 1517‑FBGA (40×40) surface‑mount package. It is designed for applications that require dense logic integration and extensive embedded RAM while operating within a commercial temperature range.

Key architectural highlights include 597,000 logic elements, approximately 53.25 Mbits of embedded memory, and 432 user I/O pins, making this device suitable for complex, board‑level programmable logic tasks that demand high integration density.

Key Features

• Logic Capacity — 597,000 logic elements (cells) to implement large-scale combinational and sequential logic functions on a single device.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for high‑bandwidth buffers, FIFOs, and local data storage without external memory.
• I/O Resources — 432 user I/O pins to support wide parallel interfaces and multiple peripheral connections at the board level.
• Power Supply — Core voltage supply range of 870 mV to 930 mV, enabling designs that target the specified core operating window.
• Package & Mounting — 1517‑FBGA (40×40) supplier device package with surface‑mount mounting for compact board placement and standard assembly flows.
• Operating Grade & Temperature — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards Compliance — RoHS‑compliant manufacturing status.
• Series Capabilities — As part of the Stratix V GX family, the series is documented to offer transceiver speed grade options; refer to device documentation for series‑level electrical and switching characteristics.

Typical Applications

• High‑density digital processing: Implement large custom datapaths, protocol engines, and parallel processing pipelines using the device’s extensive logic and memory resources.
• Board‑level systems: Leverage 432 I/O pins for wide buses, multi‑lane interfaces, and mixed‑signal board integrations where high I/O count is required.
• On‑chip buffering and packet handling: Use the substantial embedded RAM to implement FIFOs, packet buffers, and temporary storage for streaming data applications.

Unique Advantages

• High integration density: Nearly 600k logic elements reduce the need for multi‑device solutions, simplifying board layout and lowering component count.
• Large on‑chip memory: Approximately 53.25 Mbits of embedded RAM enables localized storage and reduces external memory dependencies for many designs.
• Extensive I/O capability: 432 I/O pins provide flexibility to support wide interfaces and multiple peripherals without additional I/O expanders.
• Commercial temperature rating: Rated for 0 °C to 85 °C for deployments in commercial environments and standard industrial enclosures.
• RoHS compliant: Meets environmental compliance requirements for lead‑free assembly and global distribution.
• Compact FBGA package: 1517‑FBGA (40×40) provides a high‑pin‑count solution in a compact footprint suitable for dense board designs.

Why Choose 5SGXEB6R2F40C2?

The 5SGXEB6R2F40C2 positions itself as a high‑capacity Stratix V GX FPGA suitable for designs demanding significant programmable logic and embedded memory in a single, compact package. Its combination of nearly 597,000 logic elements, approximately 53.25 Mbits of on‑chip RAM, and 432 I/O pins makes it appropriate for complex board‑level systems where integration and performance density matter.

Engineers and designers targeting commercial‑grade systems will find this device a strong candidate when they need to consolidate functions, reduce external component count, and leverage the documented electrical and switching characteristics of the Stratix V family for system planning and verification.

Request a quote or submit a sales inquiry to obtain availability, pricing, and lead‑time information for the 5SGXEB6R2F40C2. Our team can assist with ordering details and supporting documentation for your design needs.