5SGXEB6R1F43I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 184 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 225400 | Number of Logic Elements/Cells | 597000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB6R1F43I2N – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXEB6R1F43I2N is a Stratix V GX family FPGA IC from Intel designed for compute- and I/O-intensive designs. This device provides a large programmable fabric, substantial on-chip memory, and the I/O density required for complex embedded and communications systems.
As a member of the Stratix V GX series, the device aligns with the electrical and switching characteristics documented for Stratix V devices and supports the industrial temperature grade, making it suitable for designs that require extended operating range and robust power/voltage specifications.
Key Features
- Core Logic 597,000 logic elements provide extensive programmable resources for complex logic, signal processing, and custom compute functions.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM (Total RAM Bits: 53,248,000) to support buffering, look-up tables, and data-path storage.
- I/O Density 600 user I/O pins support systems requiring high pin-count interfaces and parallel connectivity.
- Power and Voltage Core voltage supply range of 870 mV to 930 mV gives defined power supply requirements for system power design and sequencing.
- Operating Range Industrial temperature grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
- Package & Mounting 1760-BBGA FCBGA package (supplier device package: 1760-FCBGA, 42.5×42.5 mm) and surface-mount form factor for board-level integration.
- Standards & Compliance RoHS compliant to support regulatory requirements for lead-free assembly.
Typical Applications
- High-speed communications Designed as part of the Stratix V GX family, which includes GX transceiver speed grades defined in the device series documentation, making it suitable for designs that leverage high-speed serial links.
- Networking and data-path acceleration High logic element count and large embedded memory enable complex packet processing, protocol offload, and custom acceleration functions.
- Industrial control and instrumentation Industrial temperature grade (−40 °C to 100 °C) and robust I/O density support control systems and test equipment that operate across wide temperature ranges.
- High-channel I/O systems 600 I/Os provide the capacity needed for multi-channel acquisition, aggregation, and parallel interfacing in demanding embedded designs.
Unique Advantages
- Substantial programmable fabric: 597,000 logic elements let you implement large custom logic blocks, complex state machines, and parallel datapaths without external ASIC support.
- Large on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying board-level memory architecture.
- High I/O capacity: 600 I/Os support dense interface requirements, minimizing the need for additional interface components and reducing BOM complexity.
- Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet extended-environment requirements common in industrial and communications equipment.
- Defined power envelope: Core supply range (870 mV–930 mV) provides clear constraints for power-supply design and system integration.
- Package options for surface mount assembly: 1760-FCBGA (42.5×42.5 mm) package supports high-density PCB layouts and automated assembly processes.
Why Choose 5SGXEB6R1F43I2N?
5SGXEB6R1F43I2N brings together a high-density logic fabric, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX device package. The combination of these specifications makes it well suited for high-throughput communications, data-path acceleration, and industrial applications that require robust operating range and defined power requirements.
Engineers and procurement teams can select this device when a design requires high logic capacity, sizable on-chip RAM, and substantial I/O in a surface-mount 1760-FCBGA package while meeting RoHS requirements and industrial temperature operation.
Request a quote or submit a purchase inquiry today to evaluate 5SGXEB6R1F43I2N for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018