5SGXEB6R1F43I2N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 597000 1760-BBGA, FCBGA

Quantity 184 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs225400Number of Logic Elements/Cells597000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB6R1F43I2N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEB6R1F43I2N is a Stratix V GX family FPGA IC from Intel designed for compute- and I/O-intensive designs. This device provides a large programmable fabric, substantial on-chip memory, and the I/O density required for complex embedded and communications systems.

As a member of the Stratix V GX series, the device aligns with the electrical and switching characteristics documented for Stratix V devices and supports the industrial temperature grade, making it suitable for designs that require extended operating range and robust power/voltage specifications.

Key Features

  • Core Logic  597,000 logic elements provide extensive programmable resources for complex logic, signal processing, and custom compute functions.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM (Total RAM Bits: 53,248,000) to support buffering, look-up tables, and data-path storage.
  • I/O Density  600 user I/O pins support systems requiring high pin-count interfaces and parallel connectivity.
  • Power and Voltage  Core voltage supply range of 870 mV to 930 mV gives defined power supply requirements for system power design and sequencing.
  • Operating Range  Industrial temperature grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
  • Package & Mounting  1760-BBGA FCBGA package (supplier device package: 1760-FCBGA, 42.5×42.5 mm) and surface-mount form factor for board-level integration.
  • Standards & Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

  • High-speed communications  Designed as part of the Stratix V GX family, which includes GX transceiver speed grades defined in the device series documentation, making it suitable for designs that leverage high-speed serial links.
  • Networking and data-path acceleration  High logic element count and large embedded memory enable complex packet processing, protocol offload, and custom acceleration functions.
  • Industrial control and instrumentation  Industrial temperature grade (−40 °C to 100 °C) and robust I/O density support control systems and test equipment that operate across wide temperature ranges.
  • High-channel I/O systems  600 I/Os provide the capacity needed for multi-channel acquisition, aggregation, and parallel interfacing in demanding embedded designs.

Unique Advantages

  • Substantial programmable fabric: 597,000 logic elements let you implement large custom logic blocks, complex state machines, and parallel datapaths without external ASIC support.
  • Large on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying board-level memory architecture.
  • High I/O capacity: 600 I/Os support dense interface requirements, minimizing the need for additional interface components and reducing BOM complexity.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet extended-environment requirements common in industrial and communications equipment.
  • Defined power envelope: Core supply range (870 mV–930 mV) provides clear constraints for power-supply design and system integration.
  • Package options for surface mount assembly: 1760-FCBGA (42.5×42.5 mm) package supports high-density PCB layouts and automated assembly processes.

Why Choose 5SGXEB6R1F43I2N?

5SGXEB6R1F43I2N brings together a high-density logic fabric, significant embedded memory, and a large I/O complement in an industrial-grade Stratix V GX device package. The combination of these specifications makes it well suited for high-throughput communications, data-path acceleration, and industrial applications that require robust operating range and defined power requirements.

Engineers and procurement teams can select this device when a design requires high logic capacity, sizable on-chip RAM, and substantial I/O in a surface-mount 1760-FCBGA package while meeting RoHS requirements and industrial temperature operation.

Request a quote or submit a purchase inquiry today to evaluate 5SGXEB6R1F43I2N for your next design.

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